Taiwan's top PCB supplier Zhen Ding Technology will focus more on high-end IC substrates, particularly ABF substrates, to bolster its future revenue growth amid persistently strong...
China's fast-growing multilayer ceramic capacitor (MLCC) market will see the country account for 43.5% of global MLCC demand by 2025, making it the largest, according to the Chinese...
Market observers are generally optimistic about the IC substrate and automotive PCB market prospects in the long term, with both product segments to become major growth drivers for...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and...
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Samsung Electro-Mechanics (Semco) on March 21 announced that it will expand its ABF substrate production capacity at its Busan plant, bringing its total investment in the segment...
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), has expressed...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
