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NEWS TAGGED SEMCO
Monday 11 May 2020
Zhen Ding, Unimicron looking to extend lead over peers via bold capex injection
The coronavirus pandemic may force many Taiwan-based PCB makers to slow down their capacity expansion plans in the short term due to uncertain market prospects, but Zhen Ding Technology...
Tuesday 7 April 2020
Taiwan MLCC, resistor makers see mostly orders with short lead time
Taiwan-based passive component makers have landed mostly short lead time orders recently from clients seeking to replenish their inventory, with order visibility clear just one month...
Thursday 27 February 2020
Yageo sees MLCC, chip resistor inventory hit 10-year low
Passive components maker Yageo has seen its inventory for MLCCs and chip resistors hit the lowest levels in nearly 10 years and will properly raise prices to reflect increased costs,...
Tuesday 25 February 2020
MLCC, chip resistor prices set to rise through 2020
Prices for MLCCs and chip resistors are expected to rise through the fourth quarter of 2020 as supply will increasingly fall short of demand for 5G applications while fallouts of...
Monday 24 February 2020
Taiwan PCB makers urged to accelerate capacity relocation amid outbreak
Taiwan's PCB makers are facing higher risks from the coronavirus outbreak thanks to relatively heavier production deployments in China than their peers in Japan and South Korea, prompting...
Wednesday 5 February 2020
MLCC, resistor lead time significantly extended on tight supply
The supply of MLCC and resistor chips is getting increasingly tight with delivery lead time stretching significantly, which may soon push up quotes as major makers including Yageo...
Wednesday 25 December 2019
Samsung to source more HDI PCBs from Korea suppliers
Samsung Electronics reportedly will place more orders with its existing suppliers DAP and Korea Circuit, rather than their Taiwanese peers, after the withdrawal of its PCB supply...
Tuesday 17 December 2019
Semco quits HDI market to focus on IC substrates
Samsung Electro-Mechanics (Semco), following the footsteps of LG Innotek, has announced quitting the HDI market, officially closing its plant in Kunshan, China to focus on production...
Tuesday 19 November 2019
Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The acquisition is expected...
Wednesday 13 November 2019
Nan Ya set to expand ABF substrate capacity in 2020
Nan Ya PCB has disclosed plans to invest an additional US$48 million in its factory in Kunshan, China, where the Taiwan-based company will expand ABF substrate production capacity...
Friday 2 August 2019
Chipbond posts profit surge in 1H19
LCD driver IC backend specialist Chipbond Technology has reported net profit surged 76.2% from a year earlier to NT$1.98 billion (US$63.2 million) in the first half of 2019. EPS for...
Thursday 13 June 2019
JMC finds strength to compete with bigger rivals
Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...
Monday 13 May 2019
Samsung enters AiP module production for 5G mmWave
Qualcomm has introduced the world's first 5G NR mmWave antenna modules and sub-6 GHz RF modules for smartphones and other mobile devices, but Samsung is fast catching up.
Tuesday 19 March 2019
COF substrate prices to rise 8-15% in 2Q19
COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.
Monday 29 October 2018
Samsung developing FOPLP for wearable devices
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
Jun 30, 09:59
DataVan's smart solutions empower retail industry to meet new demand from new normal
Wednesday 29 June 2022
ADATA launches industrial-grade 31C series 112-Layer 3D NAND (BiCS5) solid state drives
Wednesday 29 June 2022
Digitalization as key for transformation to smart manufacturing: ZNT's detailed market approach to further support valued customers in Asia-Pacific region
Wednesday 29 June 2022
UMC climate goals validated by SBTi
TSMC sees major clients queue up for 3nm process capacity
GF, SMIC may bear the brunt of consumer chips demand downturn
TSMC to initiate about 6% price hike in 2023
Intel cutting Alder Lake CPU prices to attract order pull-ins from PC brands
AMD to launch new-gen desktop CPUs in mid-September
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
Servers with non-Intel CPUs to enjoy rising shipment shares over next two years, says DIGITIMES Research
AIO PC shipment decline to in 2Q22, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – May 2022
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