Samsung Electronics is reportedly planning to introduce a vertical 4F Square structure for its in-development 9nm DRAM products, while continuing development of the existing 6F Square...
Samsung and Vivo are ramping up competition in Taiwan's foldable phone segment. Following the launch of Samsung's latest Galaxy Z series with a bold 30% year-over-year growth target,...
Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
Samsung has reported strong pre-orders in Taiwan for its latest Galaxy Z7 series, with the vendor assessing the feasibility of bringing its trifold devices to the Taiwanese market...
Samsung Electronics plans to begin mass production of its 2nm semiconductor process in the second half of 2025. Although reports indicate that Samsung is currently trailing TSMC in...
The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
Samsung Electronics executives met with BOE Technology leaders in July 2025 to discuss LCD panel procurement, even as the company remains locked in a legal dispute with Samsung Display...
Samsung Electronics' Visual Display (VD) division, responsible for Samsung's TV business, has been experiencing internal disorder since May 2025, a negative byproduct of its workplace...
Taiwanese microLED manufacturer PlayNitride is confronting its first significant slowdown after years of rapid expansion, with first-half revenue falling 4.64% to NT$504 million (approx...
Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
Samsung is strengthening its partnership with Mercedes-Benz on two strategic fronts—melding cutting-edge display technology with mobile-powered vehicle access—signaling...
In comments after the recent Samsung Unpacked event, Samsung Electronics' acting head of device experience (DX) Tae-moon Roh revealed the company's plans to release a trifold smartphone...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
China's top memory chipmakers, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technology Corp. (YMTC), have nearly doubled their output in just over a year. Their rapid expansion...
