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Friday 13 June 2025
Micron reportedly clinches SOCAMM lead with Nvidia's greenlight
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
Friday 13 June 2025
Samsung, SK Hynix redo strategies ahead of HBM4 mass production, says report
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
Friday 13 June 2025
Taiwan’s smart home market heats up with Mova’s debut
Taiwan's smart home market is gaining momentum as brands increasingly integrate artificial intelligence (AI) and generative AI into their product lines. This trend is drawing not...
Friday 13 June 2025
Samsung launches 32-inch color e-paper signage with ultra-low power consumption
Samsung Electronics has introduced a digital signage display that can retain images without a continuous power supply, marking a major advancement in energy-efficient display technology...
Thursday 12 June 2025
Samsung reportedly fails third Nvidia HBM3E test; eyes re-certification in September
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
Wednesday 11 June 2025
DDR4 crunch sends prices soaring 50%
Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally...
Wednesday 11 June 2025
Apple's 'Liquid Glass' UI redesign backfires, creating opportunities for Android 16
Apple's introduction of its redesigned user interface at WWDC has elicited a range of responses from consumers, coinciding with Google's official launch of Android 16, the newest...
Wednesday 11 June 2025
Micron ships HBM4 samples to key customers, targets 2026 ramp up
According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is...
Wednesday 11 June 2025
Samsung and Groq to produce world's fastest AI chip using 4nm process, mass production slated for 2H25
Samsung Electronics' foundry division is targeting the artificial intelligence (AI) chip market with a new collaboration alongside Groq, aiming to bring their jointly developed chip...
Wednesday 11 June 2025
Samsung reportedly ramps up Taylor fab construction, eyeing operational by 2026
Samsung Electronics has reportedly accelerated construction at its US$37 billion wafer fab in Taylor, Texas, reaffirming its target to begin production by the end of 2026. After earlier...
Tuesday 10 June 2025
Qualcomm seals Autotalks deal, expands V2X chip output with Samsung Foundry
Qualcomm CDMA Technologies (QCT), a unit of Qualcomm Inc., has finalized its acquisition of Israeli vehicle-to-everything (V2X) chipmaker Autotalks, reinforcing its push into connected...
Tuesday 10 June 2025
Samsung likely to rely on HBM4 as UBS reports delay in 12-layer HBM3E certification
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
Tuesday 10 June 2025
South Korean industry optimistic about Samsung's potential Middle East expansion; AI chip orders seen as key
Following reports that TSMC is considering establishing a semiconductor wafer fab in the Middle East, some observers suggest that Samsung Electronics may also seek opportunities to...
Tuesday 10 June 2025
SmartSens lands Huawei flagship win as China's CIS upstarts squeeze Samsung
Huawei will debut its flagship Pura 80 series on June 11, 2025, with sales starting June 14. The highlight is the premium Pura 80 Ultra, equipped with a new 1-inch CMOS image sensor...
Monday 9 June 2025
Samsung reportedly races to LPDDR6 with 1c DRAM by late 2025 to fend off Chinese rival
Samsung Electronics is accelerating its development of next-generation low-power memory technology, aiming to begin production of LPDDR6 using its advanced 1c DRAM process in the...