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NEWS TAGGED SAMSUNG
Wednesday 4 June 2025
Semco reportedly expanding semiconductor-use glass substrate ecosystem
Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics...
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
Wednesday 4 June 2025
Samsung and Intel take foundry fight into each other's backyard
Samsung Electronics and Intel are taking their semiconductor foundry competition directly to each other's home turf in June, as both companies seek to narrow the gap with market leader...
Wednesday 4 June 2025
Samsung executives visit Nvidia headquarters to secure HBM supply deal
Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
Tuesday 3 June 2025
Samsung rides GDDR7 wave as Nvidia, AMD shift to comply with US export curbs
In response to intensified US export controls on advanced semiconductor shipments to China, major chipmakers Nvidia and AMD are reportedly adopting Samsung Electronics' GDDR7 graphics...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
Samsung recruits former TSMC, NXP exec to lead US foundry push
Samsung Electronics' Device Solutions (DS) division has appointed former TSMC and NXP Semiconductors executive Margaret Han as vice president of its North American wafer foundry business,...
Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...

Tuesday 3 June 2025
Modem independence proves elusive as Apple and Xiaomi grapple with custom designs
Apple's first real effort to cut ties with Qualcomm's modem dominance appears to have stumbled out of the gate. Qualcomm commissioned Cellular Insights to run real-world 5G tests...
Monday 2 June 2025
Samsung squeezed: TSMC scales 3nm heights, SMIC cracks 5nm
Samsung Foundry has boosted utilization with fresh 7nm and 8nm chip orders from Nintendo and multiple AI chipmakers. Yet its persistent setbacks at the 3nm node continue to spotlight...
Monday 2 June 2025
Xiaomi's XRing O1 fast-tracks in-house SoC lessons Apple took 15 years to learn
When Xiaomi founder and CEO Lei Jun set his sights on replicating Apple's vertical integration playbook, he may have overlooked how unceremoniously Apple's own chip journey began...
Monday 2 June 2025
Samsung nears wide-ranging deal with Perplexity for AI features
Samsung Electronics is nearing a wide-ranging deal to invest in Perplexity AI Inc. and put search technology from the artificial intelligence startup at the forefront of the South...
Monday 2 June 2025
Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Monday 2 June 2025
India roundup: Trump tariff threat pressures Apple on India
US President Donald Trump has pressured Apple into de-accelerate its investments in India, which may have limited impact on the company's diversification strategy.
Friday 30 May 2025
Samsung activates crisis planning, lines up US$7.27 billion in bank credit
Facing mounting pressure from high US tariffs and a prolonged global economic slowdown, Samsung Electronics has reportedly activated a crisis management framework and signed a credit...