The in-house chip development programs of leading Chinese smartphone makers has been under spotlight. On May 31st, Huawei-spinoff smartphone brand Honor set up a wholly-owned subsidiary...
Nvidia has become the second American multinational semiconductor company to receive subsidies from the "Pilot Enterprise R&D Deep Dive Program" launched by the Department of...
Japanese precision component manufacturer Orbray announced that it has signed a contract with automotive semiconductor R&D corporation Mirise Technologies to conduct R&D on...
US-based Applied Materials will spend US$4 billion and leverage the subsidies provided by the US government to build an R&D center in Silicon Valley to strengthen the collaboration...
Analog Devices has announced a new EUR630 million (US$678.4 million) investment at its European regional headquarters in Limerick, Ireland. The funds will be used to build a new 45,000-square-foot...
SkyWater Technology has announced on May 8 its financial results for Q1 2023. The US-based company, listed as a "trusted foundry" by the US Department of Defense, saw its revenue...
Silicon Motion Technology, a memory device controller IC company, has seen an increase in client orders that may lead to a stronger market rebound by the end of 2023.
Though Samsung Electronics decided to artificially reduce production amid memory market downturn, it has also decided to increase wafer production for R&D. It is believed that...
Optoma, a subsidiary of Coretronic, has partnered with Tawan's National Yang-Ming Chiao-Tung University (NYCU) to work on building an R&D center for AI and VR interaction and...
China's push to become self-reliant in the technology sphere is driving more European companies operating there to rethink their research and development plans, according to a report...
Volkswagen unveiled another project to gain a presence in the world's largest EV market. The carmaker said it will invest EUR1 billion (US$1.1 billion) in building an EV R&D and...
Japan is attempting to revitalize its chipmaking sector and strengthen related industry supply chains. Its current focus is on logic ICs. As a result of this strategy, two new chipmaking...
China-based EV company Xpeng released its latest vehicle architecture, Smart Electric Platform Architecture 2.0 (SEPA 2.0), on April 16. It said the system will shorten future models'...
Chinese mobile operators and telecom equipment providers are already engaged in 6G technology R&D, eyeing to lead in the next generation of wireless communication, according to...
ASML has filed to Taiwan's Ministry of Economic Affairs for R&D subsidies to fund the development and production of 2nm wafer optical measurement equipment, a report by Taiwan's...
