The US Department of Commerce and Micron Technology have signed a non-binding Preliminary Memorandum of Terms (PMT) to provide up to US$6.14 billion in direct funding under the CHIPS...
To drive the technologies and products of the future, creative companies rely on end-to-end solutions across chips, IPs, packages, PCBs, and systems to meet strict design requirements...
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Semiconductors encompass a wide spectrum of critical technologies, making it difficult for any single country to dominate, according to Burn-Jeng Lin, former TSMC VP of R&D.
Delta Electronics (Thailand), a subsidiary of Delta Group, recently inaugurated its new Delta Plant 8 and R&D Center at Bangpoo Industrial Estate, Thailand, to facilitate Delta's...
Zhou Meisheng, former EVP of technology R&D at Semiconductor Manufacturing International (SMIC), has joined Chinese DRAM manufacturer ChangXin Memory Technologies (CXMT).
In a recently announced chipmaking project in India in partnership with India and Thailand-based companies, Renesas expressed cautiousness about the investments by starting with ATMP...
Despite headwinds in the chip industry, M31 Technology achieved a consolidated revenue growth of 18.5% year-on-year in 2023, reaching a historical high of NTD1.612 billion. The silicon...
Samsung expanded its semiconductor R&D capabilities by opening a second office in Bengaluru, as global IC design houses are setting up R&D centers amid a growing semiconductor...
Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...
