Japan toolmaker Disco reports record R&D expenses, focuses on HBM, SiC wafer-cutting equipment

Chiang, Jen-Chieh; Willis Ke, DIGITIMES Asia 0

Credit: Disco

Japan's Disco Corp, with its 70-80% share of the global wafer cutting and grinding equipment market, experienced a remarkable threefold increase in market value within a year in 2023.

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