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NEWS TAGGED PACKAGING
Monday 11 November 2024
ASE expands to Mexico with first North American packaging facility post-US election
ASE Holdings' North American subsidiary, ISE Labs, has announced a land acquisition in Guadalajara's Axis 2 industrial park, marking its first packaging facility expansion outside...
Wednesday 6 November 2024
Kyocera faces challenges in entering AI chip supply chain amid organic packaging substrate slump
Japan's component manufacturer Kyocera Corporation is experiencing a downturn in its semiconductor organic packaging materials business. Current demand has not met previous forecasts,...
Wednesday 6 November 2024
Backend firm ChipMOS cautious on 2025 capex amid DDI market concerns
ChipMOS Technology has embraced a cautious approach to capital expenditures for 2025 and anticipates that the demand for display driver ICs will experience a more pronounced correction...
Tuesday 5 November 2024
MA-tek to open Hokkaido lab early to meet 2nm chip demand
MA-tek will launch its new lab in Hokkaido, Japan by the end of this year, well ahead of schedule, to meet increasing demand for inspection and analysis services supporting 2nm chip...
Tuesday 5 November 2024
AUO pivots to silicon photonics over FOPLP race
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
Tuesday 5 November 2024
CHPT posts double-digit revenue increases in October
Chunghwa Precision Test Tech (CHPT), a developer of IC test interface solutions, experienced double-digit revenue growth on both an annual and sequential basis in October 2024 as...