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TSMC supports Japan's advanced packaging plant construction

Monica Chen, Hsinchu; Emily Kuo, DIGITIMES Asia Monday 9 February 2026 0

Credit: DIGITIMES

TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process, signaling Japan's plan to reclaim its semiconductor glory. However,...

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