On August 28, Niching presented strong growth prospects at its latest investor conference, highlighting the AI-driven opportunities for cooling solutions. The company's improved product...
Tex Year Industries is set to optimize its manufacturing operations across Taiwan, Vietnam, the US, and other Asian locations in response to ongoing tariffs and geopolitical challenges...
AEMC, Nanpao, and Trusval, on August 28, 2025, announced the establishment of a joint venture (JV) with a capital of NT$500 million (US$16.4 million). The shareholding is divided as...
boAt has partnered with semiconductor startup HrdWyr to launch the HrdWyr Indus 1011, a high-volume chip fully designed in India, with assembly, packaging, and testing enabled by Tata...
According to BusinessWire, CG Semi Private Limited, a subsidiary of CG Power and Industrial Solutions Limited and part of the Murugappa Group, has inaugurated its first Outsourced...
Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won...
ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence...
Samsung Electro-Mechanics (Semco) has recently adjusted its IC substrate supply chain, appointing Mitsubishi and Resonac as the primary suppliers for key materials such as copper-clad...
Intel is grappling with accelerating staff departures as CEO Pat Gelsinger pushes through sweeping restructuring efforts and cancels projects championed by his predecessor. The financially...
TSMC's strong second-quarter results demonstrated resilience amid global challenges, posting a 58.6% gross margin and NT$759.83 billion (US$24.93 billion) revenue in the first half...
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in...
As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...
