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Samsung accelerates HBM hybrid bonding line to meet Nvidia demand

Lillian Chen, Taipei; Eifeh Strom, DIGITIMES Asia Tuesday 17 February 2026 0

Credit: Samsung

Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus in South Korea to support the higher stacking transition to high-bandwidth...

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