TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Taiwanese equipment manufacturer C Sun, originally focused on the panel and PCB industries, has strategically pivoted toward the semiconductor sector. About fourteen years ago, C...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...
Applied Materials reported growth across all segments, driven by AI-fueled demand and advancements in semiconductors, including gate-all-around (GAA), high-bandwidth memory, and advanced...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
DIGITIMES Research released a special report on AI chips on August 14, highlighting the rapid development of the semiconductor market driven by generative AI.
The 2024 International Semiconductor Exhibition (SEMICON Taiwan) is set to launch on September 4, focusing on semiconductor technologies crucial to the emerging AI era.
At the "Made by Google" keynote event, Google announced a series of new hardware devices, including the new Pixel 9 series of smartphones, the Pixel Buds Pro 2 earphones, and the...
TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...
Taiwan-based chip inspection supplier Utechzone has reported substantial growth in earnings, thanks to its successful expansion into the advanced packaging equipment market. The company's...
