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TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push

Lillian Chen

, Taipei

May 12, 2026, 17:17 0

Credit: AFP

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators.

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