News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Monday 2 March 2026

India roundup: An emerging chip trio in Asia

A trilateral semiconductor model is emerging, combining Japan's capital, Taiwan's ecosystem expertise,...

Sunday 1 March 2026

Micron opens semiconductor assembly and test facility in India

Micron Technology has inaugurated its first semiconductor assembly and test facility in Sanand, expanding its global manufacturing footprint while supporting India's efforts to strengthen...

Saturday 28 February 2026

BOE signals sustained TV panel price gains, speeds up OLED, packaging and perovskite push

China's leading panel maker BOE Technology Group has expressed cautious optimism about the LCD TV panel market in the first half of 2026, announcing accelerated progress on AMOLED...

Friday 27 February 2026

ASE's Tien Wu: betting on American trust in a divided chip world

In the high-stakes world of global semiconductors, where microscopic precision meets massive geopolitical shifts, Dr. Tien Wu stands as a rare figure:...

Friday 27 February 2026

TSMC pushes Japanese suppliers to localize electroplating additives in Taiwan

As AI-driven demand continues to lift global semiconductor output, TSMC is accelerating the localization of electroplating additives used in advanced packaging to secure a stable supply...

Thursday 26 February 2026

Macronix January profit surges 195%; OSE, Walton earnings rise

Despite persistent noise in the memory market, leading memory chipmaker Macronix reported a sharp surge in profitability in January 2026. The company posted preliminary pre-tax net...

Thursday 26 February 2026

Taiwan Mask posts nearly NT$100m profit in January, advanced packaging to boost revenue in 2H26

Benefiting from its group integration strategy, Taiwan Mask Corporation (TMC) is seeing operations that are gradually recovering. The parent company's core business has seen five consecutive...

Thursday 26 February 2026

Fiberglass shortage persists in 2026, Unimicron increases substrate price

As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly...

Thursday 26 February 2026

Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?

All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...

Thursday 26 February 2026

GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.)...

Wednesday 25 February 2026

Unimicron names UMC's SC Chien chair in substrate strategy shift

Unimicron held an investor conference on 25 February 2026. A day earlier, its board approved the appointment of UMC co-president SC Chien as chairman and group chief strategy officer...

Wednesday 25 February 2026

TSMC's record profits signal AI boom far from over

Blowout earnings from TSMC in 2025 — and an even more bullish outlook for 2026 — have reignited investor enthusiasm across the global semiconductor sector. Attention is...

Wednesday 25 February 2026

ChipMOS raises memory test prices again, signs 3-year capacity contract

ChipMOS returned to profitability in 2025 after a fourth-quarter 2025 rebound driven by memory shortages and higher test prices, and the company forecasts a stronger second-half performance...

Wednesday 25 February 2026

India's Kaynes Semicon deepens ties with Synopsys in push toward advanced packaging

Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation software from Synopsys to strengthen its outsourced semiconductor...

Wednesday 25 February 2026

ASE accelerates panel-level packaging push with fully automated 310mm line by 2026

AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...

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BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook