Force-MOS Technology, currently involved in litigation with Asus, saw its profitability impacted by substantial legal fees in 2024. According to market analysts, the company needs...
As US President Donald Trump continues to make statements about Taiwan's semiconductor industry, concerns are rising that the US might replicate its past tactics of undermining Japan's...
US President Donald Trump announced plans to impose 25% tariffs on auto imports, semiconductors, and pharmaceuticals starting as early as April 2, with potential increases over time...
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...
China plans to prohibit non-state companies from mining rare earths, further tightening its control over a strategic sector that has emerged as a battleground in its trade war with...
The advent of DeepSeek and other factors are contributing to the current shortage of Nvidia's GPUs, as Taiwan's AI industry supply chain is on the brink of entering its third wave...
Siemens Digital Industries Software announced the readiness of an automated and certified workflow for TSMC's InFO packaging technology, leveraging Siemens' advanced packaging integration...
SMIC is advancing the second phase of its Beijing wafer fab, set to break ground in early 2025. The project, expected to be the city's largest logic IC foundry, comes with a total...
The rapid rise of AI-driven applications in smart healthcare, semiconductors, and data storage has pushed many Taiwanese companies traditionally focused on automotive components to...
Young Optics' consolidated revenue declined by 14.6% year over year in 2024 to NT$2.572 billion (US$78.7 million), largely due to competition from Chinese mid-range single-panel LCD...
Kaynes SemiCon is strengthening its position in the outsourced semiconductor assembly and test (OSAT) market, moving closer to securing new customers from Japan and the US as part...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
Apple is ramping up efforts to develop its own wireless connectivity chips, signaling a shift away from suppliers. The company is advancing in modem, Wi-Fi, and RF chip development,...
Nikon plans to introduce a new ArF immersion lithography system platform in fiscal year 2028 (April 2028 - March 2029) that offers compatibility with ASML equipment, marking a strategic...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
