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Thursday 4 September 2025
GlobalFoundries finds new road in China: Zensemi partnership anchors auto chip strategy
GlobalFoundries (GF), the US-based contract chipmaker, is accelerating its "China for China" strategy through a partnership with Guangzhou Zen Semiconductor (Zensemi). The collaboration...
Thursday 4 September 2025
China's SiC substrate industry faces setback, seeks strategic pivot
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Thursday 4 September 2025
Hermes Testing expands probe solution business amid AI-driven semiconductor demand
Hermes Testing, a testing solutions provider under Hermes Epitek, is leveraging its machine engineering services and customized equipment manufacturing to address growing demand in...
Thursday 4 September 2025
Commentary: TSMC's Songjiang escape highlights Korean chipmakers' China trap
The US Department of Commerce's Bureau of Industry and Security (BIS) has revoked the "Validated End-User" (VEU) status for Samsung Electronics and SK Hynix, ending a key exemption...
Thursday 4 September 2025
Tech Forum 2025: TSMC faces the next decade of chip war from Arizona to Beijing
Taiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global...
Thursday 4 September 2025
Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged optics
Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven...
Wednesday 3 September 2025
Tech Forum 2025: 2nm race begins, advanced packaging takes the baton, Trump 2.0 reshapes chip rivalry
DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore's Law in semiconductors. However, with short-channel effects emerging, the three...
Wednesday 3 September 2025
Etron chair optimistic about US Section 232 investigation results
Nicky Lu, chairman of Etron Technology, stated that the global semiconductor industry is expected to grow from US$300 billion in 2010 to US$2 trillion by 2040. Meanwhile, system applications...
Wednesday 3 September 2025
GCCS poised for growth in China+1 SiC substrate market
Taiwan's GCCS has become a preferred third-party supplier for global semiconductor and EV giants amid China's SiC substrate price wars. Chairman Chung-Chieh Chang expects long-term...
Wednesday 3 September 2025
MicroLED technology opens new opportunities for equipment makers
MicroLED is regarded as the next-generation display technology, with Taiwan leading global development due to strong semiconductor and display integration, plus government support...
Wednesday 3 September 2025
EV Group promotes Yu-Ying Lee to lead Taiwan operations amid expanding semiconductor market
EV Group (EVG), a leading player in semiconductor process solutions, announced on September 2, 2025, the promotion of Yu-Ying Lee (Cindy Lee) to general manager of its Taiwan branch,...
Wednesday 3 September 2025
TSMC surpasses Intel in US silicon photonics patents as chip industry ramps up initiatives
TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
Wednesday 3 September 2025
Why TSMC is holding back on advanced packaging despite soaring demand
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
Wednesday 3 September 2025
Tokyo Electron expands India footprint as Japan ups chip investment
Tokyo Electron has announced plans to open new offices in India to support the country's growing chip industry. According to ANI and the Economic Times, senior executives...
Wednesday 3 September 2025
China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...