GlobalFoundries (GF), the US-based contract chipmaker, is accelerating its "China for China" strategy through a partnership with Guangzhou Zen Semiconductor (Zensemi). The collaboration...
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Hermes Testing, a testing solutions provider under Hermes Epitek, is leveraging its machine engineering services and customized equipment manufacturing to address growing demand in...
The US Department of Commerce's Bureau of Industry and Security (BIS) has revoked the "Validated End-User" (VEU) status for Samsung Electronics and SK Hynix, ending a key exemption...
Taiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global...
Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven...
DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore's Law in semiconductors. However, with short-channel effects emerging, the three...
Nicky Lu, chairman of Etron Technology, stated that the global semiconductor industry is expected to grow from US$300 billion in 2010 to US$2 trillion by 2040. Meanwhile, system applications...
Taiwan's GCCS has become a preferred third-party supplier for global semiconductor and EV giants amid China's SiC substrate price wars. Chairman Chung-Chieh Chang expects long-term...
MicroLED is regarded as the next-generation display technology, with Taiwan leading global development due to strong semiconductor and display integration, plus government support...
EV Group (EVG), a leading player in semiconductor process solutions, announced on September 2, 2025, the promotion of Yu-Ying Lee (Cindy Lee) to general manager of its Taiwan branch,...
TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
Tokyo Electron has announced plans to open new offices in India to support the country's growing chip industry. According to ANI and the Economic Times, senior executives...
Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
