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Wednesday 26 February 2025
Trump administration pressures TSMC to partner with Intel in bid for stronger US ties
The Trump administration has reportedly urged TSMC to partner with Intel and expedite its investments in the US. Sources suggest that TSMC is weighing a controlling stake in Intel's...
Wednesday 26 February 2025
US govt pressures South Korean firms with US$1 billion investment target
Donald Trump, President of the United States, has repeatedly signaled potential tariff increases on semiconductors and possible adjustments to the CHIPS Act subsidies, intensifying...
Wednesday 26 February 2025
China's mature-node foundry price war eases as global clients shift orders
China's aggressive price war in mature-node wafer manufacturing appears to be stabilizing, as Vanguard International Semiconductor (VIS) reports shifting customer orders. Chairman...
Wednesday 26 February 2025
ChipMOS forecasts modest 1Q25 revenue decline; aims to raise utilization
Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines,...
Wednesday 26 February 2025
STMicroelectronics CEO faces replacement: What happened?
STMicroelectronics (STMicro), a Franco-Italian chipmaking joint venture, is navigating significant pressures due to a downturn in key markets and internal performance concerns.
Wednesday 26 February 2025
Hidden visionary behind China's CMOS image sensor revolution
Fueled by the surging demand for CMOS Image Sensor (CIS) components in intelligent driving systems and consumer electronics, Will Semiconductor (WillSemi), the company behind OmniVision,...
Wednesday 26 February 2025
Samsung reportedly begins mass production of Exynos 2500
Samsung Electronics has reportedly started mass production of its Exynos 2500 application processor (AP) and will begin wafer testing as soon as March. Testing will be conducted by...
Wednesday 26 February 2025
India's legacy fab overhaul may involve PSMC, Tata
The Indian government has initiated a major upgrade of its semiconductor capabilities at the Semiconductor Laboratory (SCL), India's first wafer fab, in Mohali with an RFP. This move...
Wednesday 26 February 2025
Auto market remains sluggish as Onsemi cuts 9% of workforce
Onsemi has announced a significant restructuring plan in response to the ongoing challenges in the automotive chip market. On February 25, 2025, the company revealed its intention...
Wednesday 26 February 2025
Tata eyes 10 MoUs in semiconductor foray
The Tata Group is set to expand its influence in the semiconductor sector by signing Memoranda of Understanding (MoUs) with ten semiconductor firms, reports India Today.
Wednesday 26 February 2025
GlobalWafers profitability impacted by loss from Siltronic investment
Taiwan-based GlobalWafers has reported sharp declines in profits for 2024, mainly as a result of mark-to-market valuation changes on its holdings of Germany-based Siltronic AG shar...
Wednesday 26 February 2025
Macronix, TSRI announce new 3D DRAM technology
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
Wednesday 26 February 2025
Trump team pushes tougher chip controls on China, pressuring key allies
Donald Trump's administration is sketching out tougher versions of US semiconductor curbs and pressuring key allies to escalate their restrictions on China's chip industry, an early...
Wednesday 26 February 2025
Is Apple's US$500 billion US bet a turning point? Foxconn's strategic moves suggest so
As US tariffs on Mexico and Canada approach implementation after a one-month delay, manufacturers are reassessing US-based production strategies. Apple has pledged a US$500 billion...
Wednesday 26 February 2025
Samsung signs licensing agreement with YMTC for Hybrid Bonding tech
Samsung Electronics has reportedly signed a patent licensing agreement with Chinese NAND Flash manufacturer Yangtze Memory Technology Corp (YMTC) to license its Hybrid Bonding technology...