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Wednesday 10 September 2025
FOPLP progress is fastest in foundries, slower in testing and panel fabs
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
Wednesday 10 September 2025
AI infrastructure investment may enter adjustment phase in 2026, with small-and medium-sized business demand driving new momentum
At the SEMICON Taiwan event held in September, key international figures from the semiconductor, robotics, and future vehicle sectors convened, highlighting Taiwan's rising importance...
Wednesday 10 September 2025
Taiwan pushes immersion cooling, CoWoS tech into US AI server supply chain
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Tuesday 9 September 2025
Kemflo International expands into activated carbon regeneration for semiconductor industry
Kemflo International has completed its activated carbon regeneration plant in Pingtung and is moving forward with environmental certification and licensing as it shifts focus toward...
Tuesday 9 September 2025
RongSemi denies fab halt as YMTC Veteran takes key role in Ningbo expansion
Simon Yang, the former YMTC CEO and later deputy chairman, has joined Rong Semiconductor (Ningbo) Co. (RongSemi) as head of its technical expert committee. The announcement came alongside...
Tuesday 9 September 2025
HBM race intensifies: Micron’s yield confidence fuels supply chain bets
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position...
Tuesday 9 September 2025
L&T Semiconductor Technologies acquires Fujitsu General Electronics' power module design assets
India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...
Tuesday 9 September 2025
Globalwafers chief warns materials, not process nodes, will decide chip industry's future
Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials...
Tuesday 9 September 2025
Aplex partners with Adirtek to enter CoWoS supply chain
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
Tuesday 9 September 2025
China's ACM ships first KrF coater-developer to logic fab as local supply chain advances
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
Tuesday 9 September 2025
Taiwan's industrial PC firms expand role in semiconductor supply chain amid rising demand
Taiwan's semiconductor sector continues to assert its significance globally, with surging demand for advanced processing and packaging technologies driving industrial PC (IPC) manufacturers...
Tuesday 9 September 2025
Intel announces leadership changes to strengthen execution and accelerate innovation
Intel has announced a series of senior leadership appointments aimed at advancing its core product business, scaling its foundry operations, and reinforcing engineering capabilities...
Tuesday 9 September 2025
TSMC and OSATs ramp up advanced semiconductor packaging amid AI-driven demand surge
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...