The new generation of AI servers has significantly upgraded its power consumption and density compared to traditional data centers. As single-cabinet power continues to rise, traditional...
The global AI boom is driving a new wave of server and data center build-outs. With hyperscalers and chipmakers expanding compute infrastructure, data transmission is surging, and...
OpenAI has entered into a strategic cooperation agreement with Hitachi, focusing on power distribution and cooling technologies for artificial intelligence (AI) data centers. The...
Schneider Electric and Nvidia have announced a global strategic partnership to advance the development of infrastructure supporting artificial intelligence workloads. The collaboration...
Microsoft has introduced microfluidics cooling, a chip-level technique that etches microchannels into silicon, allowing coolant to flow directly across the chip surface. The company...
The smart-glasses boom shows no signs of cooling, with market demand clearly established. Yet shipments have consistently fallen short of expectations, constrained by hardware limits...
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
As tech companies push the boundaries of next-generation edge AI devices like smart glasses, two major hurdles remain: weight and heat. These issues, often overlooked in a device's...
Nvidia and Intel have announced their collaboration to create custom CPUs and GPU-integrated system-on-chips (SoCs), as limitations posed by the size of GPUs and cooling requirements...
As the third quarter of 2025 draws to a close, a consensus has formed within Taiwan's IC design industry that overall demand remains weak. Notably, an increasing number of chipmakers...
Nvidia's grip on the AI surge is forcing a rethink of server design, with thermal management at the forefront. Sources indicate that cooling is shifting rapidly from air to liquid...
Apple has introduced its self-developed vapor chamber (VC) cooling technology for the first time in the iPhone 17 Pro series, aiming to maintain high performance during extended use...
Apple is preparing to debut vapor chamber (VC) cooling in the upcoming iPhone 17 Pro, with Taiwan's Asia Vital Components (AVC) and China's Suzhou Tianmai Thermal Technology reportedly...
Taiwan's Compal Electronics has announced a strategic collaboration with US-based ZutaCore, a leader in waterless direct chip liquid cooling, to bring transformative cooling technology...
South Korean telecom giant SK Telecom (SKT) is doubling down on its artificial intelligence (AI) investments in the wake of a major hacking incident. The company has officially begun...
