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NEWS TAGGED HDI
Tuesday 12 November 2013
Compeq looks to post record high revenues in 4Q13
PCB maker Compeq Manufacturing is expected to see its revenues hit a new high in the fourth quarter of 2013, buoyed by strong demand for HDI boards from smartphone vendors, according...
Thursday 24 October 2013
Unitech to ramp up HDI, rigid-flex PCB capacity in 2014
Unitech Printed Circuit Board is likely to maintain its capex budget for 2014 at NT$1.5 billion (US$51.1 million), mainly for ramping up its production capacity of HDI and rigid-flex...
Wednesday 23 October 2013
Orbotech presents advanced technologies for HDI and IC substrate production
Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC...
Tuesday 8 October 2013
Any-layer HDI board demand sliding on disappointed high-end smartphone sales
Demand for any-layer HDI PCBs has been weaker-than-expected since the third quarter of 2013 as high-end smartphone sales have been disappointing, according to industry sources.
Tuesday 27 August 2013
Taiwan PCB makers ramping production of any-layer HDI boards
PCB makers Compeq Manufacturing, Unitech Printed Circuit Board and Unimicron Technology have been ramping up the production of any-layer HDI boards, eliminating the likelihood of...
Friday 23 August 2013
Taiwan PCB production value to decrease 3.1% in 2013, says IEK
The production value of PCBs produced by Taiwan-based companies in Taiwan and China is forecast to decrease 3.06% to NT$499.6 billion (US$16.68 billion) in 2013, according to the...
Wednesday 24 July 2013
HDI board production utilization to stay high in 2H13
PCB makers' utilization rates for HDI boards, particularly any-layer HDI boards, will remain high despite recent speculation suggesting weaker-than-expected demand for high-end smartphones,...
Monday 24 June 2013
Unitech allocates more capacity to any-layer HDI board production
Unitech Printed Circuit Board has shifted 50% of its total HDI board capacity to any-layer products, and continues to invest aggressively in improving its manufacturing process for...
Friday 21 June 2013
Unimicron sets 2013 capex budget at NT$10-11 billion
PCB maker Unimicron Technology has set a capex budget of NT$10-11 billion (US$331.5-364.7 million) for 2013, mainly to develop thinner, high-density chip-scale package (CSP) substrates,...
Tuesday 18 June 2013
NPC 2013 capex to focus on FC CSP substrates, says president
Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...
Wednesday 8 May 2013
Drill bit maker Topoint April sales up
Topoint Technology, which manufactures drill bits for the production of IC substrates and PCBs, has announced that consolidated revenues for April 2013 increased 10.9% sequentially...
Monday 29 April 2013
Supply of any-layer PCBs to fall short in 2H13
Global supply of any-layer HDI PCBs will likely struggle to keep up with demand in the second half of 2013, when the market for mobile devices enters its peak season, according to...
Thursday 14 March 2013
Unimicron shipping any-layer HDI boards to Samsung, HTC and BlackBerry, says paper
PCB maker Unimicron Technology reportedly has landed orders for any-layer HDI boards from Samsung Electronics, HTC and BlackBerry for their latest smartphone models, according to...
Tuesday 5 February 2013
Taiwan PCB makers to raise 2013 capex
Major Taiwan-based PCB manufacturers including Unimicron Technology, Compeq Manufacturing and Unitech Printed Circuit Board have all set higher capex budgets for 2013, according to...
Thursday 13 December 2012
Availability of MediaTek quad-core solutions to boost HDI board demand
MediaTek's launch of its quad-core MT6589 smartphone solution will push China-based smartphone vendors to accelerate the development of high-end models, and therefore boost demand...