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Top 10 publicly listed IC design houses in China
EIH seeks wide application of e-paper, says chairman
Displays + Photonics
Macroblock expects sales growth in 2Q22
Before Going to Press
May 18, 22:32
NEWS TAGGED HDI
Thursday 7 April 2022
Unimicron, Nan Ya PCB see Kunshan lockdown slightly affect April revenues
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Friday 25 March 2022
Compeq poised to enjoy strong 2022
PCB manufacturer Compeq Manufacturing is poised to see its revenue hit another record high in 2022, thanks to a strong influx of flexible PCB orders for handset battery modules and...
Monday 14 March 2022
Compeq to embrace strong 1Q22
HDI PCB specialist Compeq Manufacturing is poised to enjoy a particularly strong first quarter of 2022, thanks to improvement in logic chip shortages and a pull-in of customer orders,...
Friday 4 March 2022
Nan Ya PCB doubles capex budget for 2022
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Friday 25 February 2022
EMC expects revenue growth in 1Q22
Taiwan-based copper-clad laminates (CCL) maker Elite Material (EMC) is expecting revenue growth in the first quarter of 2022 after achieving record revenue numbers last year.
Thursday 24 February 2022
Unimicron in talks about ABF substrate orders for 2027-2030
Unimicron Technology is already in talks with its major clients about ABF substrate orders for 2027-2030, as they seek to secure as much new capacity as possible through long-term...
Friday 21 January 2022
Compeq foresees intense high-end HDI PCB demand
Taiwan-based Compeq Manufacturing has expressed optimism about high-end HDI PCB demand in 2022, and expects its shipments for low-orbit satellites to double and to contribute 6-8%...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Wednesday 22 December 2021
EMC to issue bonds for capacity expansion on IC substrate CCLs
Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for...
Wednesday 15 December 2021
High-end CCL shipments to continue rising for server applications in 2022
Shipments of high-speed/frequency CCLs are expected to continue ramping up in 2022, buoyed by strong demand for server applications, as heavyweight datacenter operators Amazon, Google,...
Thursday 9 December 2021
Taiwan PCB suppliers for iPhones see revenues peak in November
Zhen Ding Technology, Flexium Interconnect and Compeq Manufacturing all saw their revenues hit the year's peak in November thanks to significant surges in their PCB shipments for...
Monday 15 November 2021
HannStar Board to increase shipment proportions for HDI, multi-layer PCBs
PCB maker HannStar Board is making efforts to increase the proportion of total shipment volume for HDI (high density interconnect) and multi-layer boards, according to company president...
Friday 5 November 2021
Compeq to expand HDI production capacity at China plant in 2022
Compeq Manufacturing has decided to further expand its capacity for high-end HDI PCB at its manufacturing base in Chongqing, China next year to meet persistently strong demand for...
Wednesday 20 October 2021
Taiwan PCB equipment suppliers busy fulfilling orders
With PCB and IC substrate suppliers looking to expand capacity, related equipment suppliers will be busy fulfilling orders that will be ramping up substantially through 2022, according...
Wednesday 13 October 2021
HDI PCB makers to embrace strong 4Q21
HDI PCB manufacturers including Compeq Manufacturing and Tripod Technology are expected to sustain strong shipment momentum in the fourth quarter of the year after posting record...
May 18, 11:03
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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