Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil...
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
China's top memory chipmakers, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technology Corp. (YMTC), have nearly doubled their output in just over a year. Their rapid expansion...
Below are the top DIGITIMES Asia stories from July 14 to 20, 2025. The top three topics include Nvidia teams up with Micron for a major SOCAMM rollout, aiming to challenge high-bandwidth...
Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
Nvidia is reportedly preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM...
SK Hynix is ramping up domestic semiconductor production as US export controls and geopolitical tensions prompt a broader reshuffling of the global memory supply chain. The company...
Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually...
Nvidia's H20 chip has been granted approval by the US government to be sold in China, despite being a lower-spec version compared to its original design. This approval has quickly...
Global memory giants are phasing out or discontinuing DDR4 DRAM production to accelerate capacity shifts toward advanced process products such as DDR5 and high-bandwidth memory (HBM),...
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
