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    NEWS TAGGED EAST ASIA
    Thursday 10 September 2026
    SK Hynix says 3D DRAM will borrow from logic foundry playbook
    SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
    Thursday 10 September 2026
    Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape
    South Korea's science ministry has budgeted KRW250 billion (US$184.6 million) for 2027 to run "AI for all," a state-funded program that aims to give every citizen free access to chatbots...
    Thursday 10 September 2026
    China gets an early shot at the next SiC power-chip cycle

    Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

    Thursday 10 September 2026
    Beyond the stage, can XPeng's EV playbook scale humanoid robots?
    As humanoid robotics glides — in its own distinctive glamour — toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Samsung trims foundry partner network as remaining DSPs gain momentum
    Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
    Thursday 10 September 2026
    Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs
    The appeal of lithium-manganese-rich (LMR) batteries has long rested on a difficult proposition: delivering relatively high energy density without carrying the same material costs...
    Thursday 10 September 2026
    CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

    Thursday 10 September 2026
    China's 6G race starts before the first 6G phone as satellite links move into the network core

    China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections...

    Thursday 10 September 2026
    Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
    Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU...
    Thursday 10 September 2026
    Apple's 100-part iPhone Duo hinge puts spotlight on Chinese suppliers
    Apple's first foldable iPhone is putting Chinese precision-component makers under closer scrutiny as its complex hinge creates new opportunities in structural parts, metal injection...
    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
    Thursday 10 September 2026
    Sumitomo, Sakana AI reportedly team up to expand Japan-made AI
    Sumitomo and its IT subsidiary SCSK are partnering with Japanese AI startup Sakana AI to expand the use of domestically developed AI among Japanese companies, leveraging Sumitomo's...
    Thursday 10 September 2026
    Arm launches second-generation CSS, targets China's AI smartphone market with C2 CPU
    Arm unveiled its second-generation mobile Compute Subsystem (CSS), Arm CSS for Mobile 2, at its annual Arm Everywhere China event in Shanghai on September 8, further integrating AI...
    Thursday 10 September 2026
    Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market
    Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
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    BIZ FOCUS
    Sep 11, 08:00
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Thursday 10 September 2026
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
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