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Monday 24 November 2025
Nvidia shifts to LPDDR for AI servers, Samsung poised to benefit most
Nvidia is reportedly adopting low-power DDR (LPDDR) memory in its servers to enhance power efficiency, marking a major shift in memory architecture. Industry analysts suggest this...
Monday 24 November 2025
Japan to become majority stakeholder in Rapidus with JPY100 billion investment
Japan's Ministry of Economy, Trade and Industry plans to invest JPY100 billion (US$671 million) in Rapidus in fiscal 2025, securing a controlling stake as the government accelerates...
Monday 24 November 2025
Toshiba's China SiC turn triggers Japan's power-chip intervention
Toshiba's sudden move from its long-standing partnership with Rohm Semiconductor to a brief collaboration with China's Sicc unsettled Japan's power semiconductor sector. Toshiba reversed...
Monday 24 November 2025
Weekly News Roundup: US moves to ban Chinese chipmaking equipment; Tesla eyes in-house fab; Intel hires TSMC veteran
These are the most-read DIGITIMES Asia stories in the week of November 17 to November 23, 2025.
Monday 24 November 2025
Exclusive: Lenovo stays insulated from DRAM crunch with Samsung ties, China supply priority
The memory shortage is rippling through the PC supply chain, prompting vendors to scramble for DRAM allocations at upstream suppliers. Industry sources say senior Asus executives...
Monday 24 November 2025
SK On swaps shares with EVE Energy to restructure joint ventures in China
South Korean battery maker SK On has restructured its investment portfolio by exchanging shares with Chinese battery firm EVE Energy, resulting in SK On acquiring full ownership of...
Monday 24 November 2025
NGK Insulators to expand capacity for chiplet ceramic support wafers that offer 5x warpage resistance
Japanese ceramics firm NGK Insulators has announced plans to triple its production capacity of support wafers by fiscal year 2027 (April 2027-March 2028). More specifically, these...
Monday 24 November 2025
Doosan poised to secure exclusive Nvidia Rubin CCL supply as EMC fails GB300 test
Doosan Electronic Business Group (Doosan Electro-Materials) is on track to become the exclusive supplier of copper-clad laminate (CCL) for Nvidia's next-generation AI chip, Rubin,...
Sunday 23 November 2025
SK Hynix reportedly plans to boost 1c DRAM output eightfold in 2026
SK Hynix is reportedly preparing a major ramp-up of its next-generation 1c DRAM production, with plans to increase capacity eightfold in 2026 to meet rising demand for high-performance...
Sunday 23 November 2025
Intel's China debut highlights AI expansion, Gaudi 2E, and disaggregated supernodes
The 2025 Intel Technology Innovation and Industry Ecosystem Conference was held from November 19 to 21, 2025, in Chongqing, China. At the event, Intel CEO Lip-Bu Tan and newly appointed...
Saturday 22 November 2025
Foxconn activates Model A for Japan, forecasting bigger CDMS impact by 2026
Electric vehicles continued to dominate Hon Hai Tech Day (HHTD25) this year, with Foxconn unveiling a fully realized version of its Model A concept and framing the project around...
Saturday 22 November 2025
South Korea's KT Sat calls for a national sovereign network amid megaconstellation dominance
As control of the low-Earth-orbit satellite market consolidates among a small number of global operators, KT Group's satellite arm, KT Sat, has issued a warning that South Korea must...
Friday 21 November 2025
Nexperia shockwaves hit auto industry as Europe and Japan slash output

The Dutch government recently suspended its administrative order against Nexperia and returned control of the chipmaker to its Chinese...

Friday 21 November 2025
Foxconn unveils Model A EV platform tailored for Japan's mobility market
On the opening day of Hon Hai Tech Day, Foxconn introduced a new reference EV, the Model A—its most concentrated focused push yet to tailor electric vehicles for specific industries...
Friday 21 November 2025
TSMC in sight: Samsung seen hitting 21,000 wafers by 2026
Samsung Electronics is reportedly planning to raise the monthly output of its next-generation 2nm foundry process to as many as 21,000 wafers by the end of 2026, according to new...