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Friday 3 July 2026
Analysis: China moves against oversized EV batteries to address fiscal and supply-chain concerns
China's state media is increasingly framing large-capacity electric vehicle (EV) batteries as a policy issue, not just a market trend. The messaging points to two priorities: reducing...
Friday 3 July 2026
India and Japan deepen economic security ties at New Delhi summit
Japanese Prime Minister Sanae Takaichi held her first summit with Indian Prime Minister Narendra Modi in New Delhi on July 2, during a three-day visit that both governments framed...
Friday 3 July 2026
Tsinghua chip veteran’s US$1.8bn 3D AI chip startup targets China’s GPU gap

China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient...

Friday 3 July 2026
Samsung escalates South Korea buildout: maps fresh US$90 billion chip, display, battery push in central region

Samsung Group detailed plans on July 2 to invest KRW140 trillion (US$90 billion) in display panels, batteries, chips, and chip materials...

Friday 3 July 2026
SK Hynix puts US$64 billion into Cheongju chip buildout
SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening...
Friday 3 July 2026
Samsung eyes marquee AI win as Anthropic explores custom chip beyond Nvidia

Anthropic is exploring a custom AI chip and has held talks with Samsung Electronics as a potential manufacturing partner, joining OpenAI,...

Friday 3 July 2026
Analysis: Innoscience-Infineon clash shows China's courts becoming a weapon in the global GaN race
A rare gallium nitride (GaN) patent clash dominated the opening day of electronica Shanghai 2026, after China's Innoscience accused Infineon of displaying GaN power products covered...
Friday 3 July 2026
Kioxia begins sample shipments of 10th-generation flash memory
Kioxia has begun sample shipments of 1Tb triple-level-cell memory devices built with its 10th-generation BiCS FLASH 3D flash memory technology. The move underscores the race to supply...
Friday 3 July 2026
Renesas trims chip portfolio to focus on AI servers and EVs

Renesas Electronics has completed the sale of its timing device business to US fabless semiconductor specialist SiTime, tightening its...

Friday 3 July 2026
Seoul seeks Kumamoto's chip playbook, but Japan's model isn't easy to copy

As South Korea moves to accelerate a new semiconductor cluster in the country's southwest, ruling-party officials have returned to...

Friday 3 July 2026
UBTech CEO says robots will take over most physical jobs in 20 years
UBtech Robotics founder and CEO Jian Zhou said at the company's 2026 global launch event that humanoid robots will gradually take over most physical and repetitive work within the...
Friday 3 July 2026
Chinese power chip price hikes lift Taiwanese suppliers
Inflationary pressures are hitting the semiconductor supply chain in 2026 as Chinese power device makers raise prices, while Taiwan-based firms say their flexibility, quality, and...
Friday 3 July 2026
Samsung's HBM4E yield tops 70%, sharpening AI memory race with SK Hynix and Micron
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening...
Friday 3 July 2026
Huawei's Ascend AI chips target South Korea in new Nvidia challenge

Huawei is reportedly preparing to launch its AI chips in South Korea for the first time in the fourth quarter of 2026, as rising demand...

Friday 3 July 2026
Innoscience says Infineon removed disputed GaN products from Shanghai trade show after patent challenge
Chinese gallium nitride (GaN) chipmaker Innoscience said on July 2 via its official WeChat account that certain GaN products from Infineon Technologies displayed at electronica China...