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Monday 12 October 2026
Samsung could unseat SK Hynix as HBM leader in 2027
Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited...
Monday 12 October 2026
Cook makes first post-CEO visit to China, lauds Guangdong's role in Apple supply chain
Apple Executive Chairman Tim Cook made his first visit to China since stepping down as Apple CEO. He visited Guangdong Province, a manufacturing hub that contains much of the iPhone...
Monday 12 October 2026
Apple's iPhone 18 order cuts expose widening divide in premium demand

Apple's iPhone 18 Pro lineup is showing mixed demand signals weeks after launch. Reports of component order cuts suggest weaker-than-expected sales,...

Monday 12 October 2026
Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys,...
Monday 12 October 2026
SK Hynix's US$299 billion chip plan faces military base hurdle
SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production...
Monday 12 October 2026
Samsung, SK Hynix accept ASML's 10% price hike in parts, report says
Samsung Electronics and SK Hynix have accepted a 10% increase in ASML's replacement-part prices for lithography systems in South Korea, with the higher rates taking effect for deliveries...
Monday 12 October 2026
LG Display unveils maskless OLED technology, targeting more efficient IT displays
LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing...
Monday 12 October 2026
Former iPhone display plant in Japan reportedly to enter AI chip supply chain
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
Monday 12 October 2026
Kawasaki Heavy Industries bets JPY550 billion on physical AI, robotics
Kawasaki Heavy Industries is betting on physical AI as part of a multibillion-dollar growth plan to modernize factories, address labor shortages, and expand robotics across shipbuilding,...
Monday 12 October 2026
CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the...

Monday 12 October 2026
Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
Monday 12 October 2026
Taiwan GDP growth hits 11% as government plan for AI dividend advances
Taiwan's gross domestic product (GDP) growth is projected to reach 11.05% in 2026, a 39-year high, driven by its technological advantage in artificial intelligence (AI), semiconductors,...
Sunday 11 October 2026
Changs Ascending September revenue jumps 92% on semiconductor plant buildouts
Changs Ascending said orders tied to semiconductor customers' new plant construction, equipment arrivals, and project acceptance schedules were gradually fulfilled and recognized as...
Saturday 10 October 2026
Unified memory lifts AI PC ambitions as Chinese open models gain local-inference ground
The hardware boundary separating cloud-scale AI from local inference is becoming increasingly porous as PC vendors expand memory capacity and software platforms make larger open-weight...
Saturday 10 October 2026
Semco moves glass substrates to package-level testing
Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...