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Saturday 4 April 2026
Semco raises ABF substrate prices as AI server demand surges
The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks...
Saturday 4 April 2026
Memory interface chip maker Montage sees DDR5 surge drive 2025 growth
Montage Technology reported full-year 2025 revenue of CNY5.46 billion (US$750 million), up 49.9% year on year, while net profit rose 58.4% to CNY2.24 billion, broadly in line with...
Saturday 4 April 2026
Samsung strike threat clouds PMIC, mature-node outlook
Samsung Electronics reportedly faces renewed strike risk after union talks stalled, threatening already tight mature-node semiconductor supply chains. Power management ICs (PMICs)...
Friday 3 April 2026
US faces split Asia: allies build 'sovereignty walls' as digital tensions rise

The 2026 National Trade Estimate (NTE) Report signals a new era of digital friction between the US and its closest Asian allies.

Friday 3 April 2026
US-China trade tensions deepen as supply chains fracture despite tariff truce

The trade environment for US businesses operating in or trading with China deteriorated sharply between 2025 and 2026, according to a comparative...

Thursday 2 April 2026
South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to ET...
Thursday 2 April 2026
South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn
South Korea's exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East...
Thursday 2 April 2026
Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo,...
Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Thursday 2 April 2026
TSMC's US expansion held ransom as JASM takes flight
TSMC is winning quietly in Japan and losing loudly in Washington — and the reason may have nothing to do with chips.
Thursday 2 April 2026
South Korea's market volatility hands Taiwan a rare edge in AI
During a lecture hosted by the Chinese National Association of Industry and Commerce (CNAIC), DIGITIMES Chairman Colley Hwang analyzed the East Asian industrial landscape...
Thursday 2 April 2026
Chinese companies capture nearly 41% of domestic AI accelerator server market
China's AI accelerator server market is gradually shifting away from using Nvidia chips to domestic GPU and AI chip makers, with Chinese companies capturing almost 41% of the market...
Thursday 2 April 2026
Opportunity in DeepSeek's turbulence: Z.ai sets sight on 'Chinese Anthropic' with API, token strategy

In late March 2026, a series of developments converged to reshape sentiment in the large model sector. Anthropic faced a major source code...

Thursday 2 April 2026
Deep dive: Huawei 2025 annual report reveals why its AI strategy starts with infrastructure

As the global AI race accelerates, Huawei's 2025 annual report leaves little ambiguity: AI now sits at the core of its strategy. The 147-page...

Thursday 2 April 2026
Denso targets US$54 billion revenue, Rohm deal faces Toshiba-Mitsubishi alliance hurdle
Japan's auto parts supplier Denso on March 31 unveiled a mid-term business plan through March 2031, targeting revenue of JPY8 trillion (approx. US$54 billion) and a return on equity...