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Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
Samsung Foundry nears full utilization, but 2nm yields remain a hurdle
Samsung Electronics' contract chipmaking business could approach full utilization in the second half of 2026, marking a potential turning point after prolonged underuse weighed on...
Tuesday 4 August 2026
China claims 8 in 10 robots worldwide are made at home

China's National Development and Reform Commission (NDRC) said humanoid robots have become a key symbol of the country's emerging manufacturing...

Tuesday 4 August 2026
HP, Asus and Acer reportedly turn to CXMT for laptop memory

HP, Asus and Acer have begun using limited quantities of DRAM from China's ChangXin Memory Technologies (CXMT) in selected budget notebooks...

Tuesday 4 August 2026
Intel China adds day 0 support for MiniMax H3 after DeepSeek

Intel China has completed day-0 adaptation for MiniMax H3, the latest multimodal generative model from Chinese AI startup MiniMax,...

Tuesday 4 August 2026
Alibaba unveils biggest Qwen model as DeepSeek deepens China's AI price war
Alibaba Group unveiled Qwen3.8-Max on August 3, calling it its largest and most capable artificial intelligence (AI) model to date, as DeepSeek's low-cost V4-Flash intensified competition...
Tuesday 4 August 2026
China tightens chip layout design protection to strengthen domestic semiconductor innovation

China has revised its regulations on the protection of integrated circuit (IC) layout designs, introducing stricter registration requirements,...

Tuesday 4 August 2026
Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed...

Tuesday 4 August 2026
CXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in...

Tuesday 4 August 2026
Taiwan-Japan semiconductor ties go beyond supply chain partnerships
Cooperation between Taiwan and Japan in semiconductors will go beyond supply-chain partnerships towards joint technological innovation and talent development, according to Taiwan's...
Tuesday 4 August 2026
CXMT listing fuels concerns over DRAM prices and global memory competition
China's CXMT drew fresh attention after its parent ChangXin Memory Technology (CXMT) went public, with market estimates of the firm's future valuation ranging from US$160 billion to...
Tuesday 4 August 2026
ispace turns to H3 for 2028 mission as Japan builds domestic lunar transport stack

Japan's effort to localize lunar transportation is gaining momentum as the government and private sector seek to reduce reliance on...

Tuesday 4 August 2026
Montage brings CXL 3.2 memory expansion to AI data centers with Samsung, SK Hynix support

Montage Technology has begun pilot production of what it says is the industry's first CXL 3.2 memory expansion controller, targeting...

Tuesday 4 August 2026
Unitree sees 1H26 revenue rise over 35% on humanoid robot demand

China's leading humanoid robot maker Unitree Technology expects first-half 2026 revenue to reach roughly CNY1.1 billion (US$155.8 million),...

Tuesday 4 August 2026
Roborock beats Samsung, LG to win over 70% of South Korea's robot vacuum market
Roborock Technology has grown from its roots in China to become the world's leading robot vacuum brand, securing the top spot in the global market for three years in a row and beating...