FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity...
Five senior Samsung Electronics executives, including the heads of its semiconductor and consumer electronics businesses, reportedly traveled to Tokyo on October 13 while chairman...
Myson Century, a subsidiary of Sun Yad Group, signed strategic memorandums of understanding with IXI EW, SafeSky Systems USA, and Global Ordnance Group at the Association of the United...
Chinese automakers are accelerating their expansion into humanoid robotics, leveraging artificial intelligence (AI) technologies, electric drive systems, and supply chain resources...
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Chun Yuan Steel expects Taiwan's auto market to deliver its strongest quarter of 2026 in the final three months, lifting full-year new-vehicle sales to 430,000 units from 411,000 in...
AI-driven NAND demand is entering a supercycle, positioning Yangtze Memory Technologies Co. (YMTC) as the fastest-growing memory supplier. According to Counterpoint Technology Market...
China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand...
Japan is stepping up its push into physical AI, with major technology companies and research institutions showcasing advances in autonomous robot learning, motion sensing, and agricultural...
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
Japan's automakers are presenting autonomous-driving systems that connect vehicles with road infrastructure as a route toward deployment, highlighting a strategic choice beyond vehicle-only...
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion...
As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment — particularly the extreme...
