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Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project

Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring...

Wednesday 19 August 2026
Alibaba's Lingxi sale shows how AI is redrawing China's Big Tech priorities

As AI infrastructure increasingly absorbs both capital and management attention across China's technology sector, even profitable businesses...

Wednesday 19 August 2026
Baidu's AI cloud engine accelerates as advertising drag deepens

Baidu's second-quarter 2026 results confirm a business in the midst of a wrenching handover: an AI-powered core that is scaling faster...

Wednesday 19 August 2026
Merida sees full-year 2026 growth as Europe and China offset US weakness

Merida said its full-year 2026 business was still set to grow, supported by stable currency conditions, near-complete inventory reduction,...

Wednesday 19 August 2026
China's new automotive chip rules target the last mile to vehicle adoption

China has introduced five automotive chip certification and accreditation industry standards aimed at easing a key obstacle to domestic...

Wednesday 19 August 2026
LG's raw material costs jump by over KRW1 trillion in 1H26, auto components hit hardest

Rising chip and copper prices are rapidly increasing cost pressure on LG Electronics.

Wednesday 19 August 2026
Samsung and SK hynix build KRW278 trillion cash pile on AI memory surge

Samsung Electronics and SK hynix have amassed a combined KRW278 trillion (approx. US$196.9 billion) in cash equivalents and short-term...

Wednesday 19 August 2026
South Korea looks beyond chips and AI with bets on SMRs, fusion and quantum

South Korea is looking beyond semiconductors and artificial intelligence for its next generation of strategic industries, naming seven...

Wednesday 19 August 2026
Samsung moves ahead of SK Hynix in 1d DRAM development race

Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM,...

Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Wednesday 19 August 2026
ams OSRAM sues distributor over alleged infringement by Refond automotive LEDs
ams OSRAM said it filed two patent infringement lawsuits in Germany against Shenzhen Refond Optoelectronics over automotive LED products. The move adds to a broader wave of intellectual...
Wednesday 19 August 2026
Humanoids become Rainbow Robotics' biggest revenue source as Korean robot makers post mixed results

Mobile humanoids became Rainbow Robotics' biggest revenue source in the first half of 2026, while ROBOTIS posted rapid actuator growth...

Wednesday 19 August 2026
US pushes South Korea to prioritize memory chip investment in trade talks
US officials have pressed South Korea to make memory chip manufacturing its first strategic investment in the US, according to a report cited by JoongAng Daily. The claim...
Wednesday 19 August 2026
Z.ai says GLM-5.3 lifts coding and cyber tests, flags Cursor vulnerability

Z.ai has released GLM-5.3, a new AI model that it said delivers major gains in coding and cybersecurity through post-training alone...

Tuesday 18 August 2026
LG Electronics lands first OSAT order for chip packaging LDI

LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early...