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Wednesday 5 August 2026
Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture,...

Wednesday 5 August 2026
CXMT-SK Hynix LPDDR6 race shifts to yields, customers and capacity

China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung...

Wednesday 5 August 2026
US reportedly expands AI infrastructure security push with planned restrictions on Chinese optical transceivers

The Trump administration is preparing new restrictions on Chinese-made optical transceivers used in AI data centers, broadening Washington's...

Wednesday 5 August 2026
China steps up challenge to Starlink: targets annual satellite output of 7,360 in major ramp-up of commercial space industry

China's commercial space ambitions are entering a new phase as Beijing accelerates efforts to build an integrated space industry capable...

Wednesday 5 August 2026
US dominates world's largest AI data centers as China places three in global top 60
The global race to build AI data centers is accelerating. According to Epoch AI's latest AI Data Centers report, more than 60 hyperscale AI data centers have either entered operation...
Wednesday 5 August 2026
China robot capital surges past US in global VC boom

Global venture capital has rebounded on the AI boom after the pandemic freeze, with total investment in the first half of 2026 already...

Wednesday 5 August 2026
From factories to consumers: Samsung's long retreat from China enters its final chapters

Samsung Electronics' latest move to scale back its smartphone retail network in China marks another milestone in a years-long restructuring...

Wednesday 5 August 2026
South Korea's KRW500B SiC push stalls as low returns deter major companies

South Korea's planned KRW500 billion(US$349,398) research and development initiative for silicon carbide (SiC) power semiconductors...

Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
Samsung Foundry nears full utilization, but 2nm yields remain a hurdle
Samsung Electronics' contract chipmaking business could approach full utilization in the second half of 2026, marking a potential turning point after prolonged underuse weighed on...
Tuesday 4 August 2026
China claims 8 in 10 robots worldwide are made at home

China's National Development and Reform Commission (NDRC) said humanoid robots have become a key symbol of the country's emerging manufacturing...

Tuesday 4 August 2026
HP, Asus and Acer reportedly turn to CXMT for laptop memory

HP, Asus and Acer have begun using limited quantities of DRAM from China's ChangXin Memory Technologies (CXMT) in selected budget notebooks...

Tuesday 4 August 2026
Intel China adds day 0 support for MiniMax H3 after DeepSeek

Intel China has completed day-0 adaptation for MiniMax H3, the latest multimodal generative model from Chinese AI startup MiniMax,...

Tuesday 4 August 2026
Alibaba unveils biggest Qwen model as DeepSeek deepens China's AI price war
Alibaba Group unveiled Qwen3.8-Max on August 3, calling it its largest and most capable artificial intelligence (AI) model to date, as DeepSeek's low-cost V4-Flash intensified competition...
Tuesday 4 August 2026
China tightens chip layout design protection to strengthen domestic semiconductor innovation

China has revised its regulations on the protection of integrated circuit (IC) layout designs, introducing stricter registration requirements,...