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Friday 2 October 2026
Tesla cuts AI5, AI6 memory specs to protect Optimus
Facing a prolonged memory supply crunch, Tesla CEO Elon Musk has announced steep cuts to the memory specifications of the company's AI5 and AI6 chips to secure enough memory for Optimus...
Friday 2 October 2026
Huawei turns to LogicFolding to keep its flagship chip race alive
Huawei Technologies has unveiled its Mate 90 smartphone series, expanding the use of self-developed Kirin processors and HarmonyOS 7 as it looks to sustain flagship performance under...
Friday 2 October 2026
China AI infrastructure spreads to mid-sized firms
China's AI investment is increasingly turning into server purchases and data center construction, and the wave that began with large tech companies is now spreading to mid-sized firms...
Friday 2 October 2026
UNEEC shifts ODM focus to racks as L11 rises to 18%
Chenming Electronic Tech (UNEEC) president Charles Lo said the fourth quarter is a traditional peak season and that new models such as VR200 will enter mass production in the fourth...
Friday 2 October 2026
JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
Friday 2 October 2026
Micron expands global fabs, calls on Taiwanese suppliers to go overseas
AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India...
Friday 2 October 2026
China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang...

Friday 2 October 2026
JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists
JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment...
Friday 2 October 2026
FAW, GAC formalize partnership as Toyota's China joint ventures face possible overhaul
China's state-owned FAW and GAC's controlling shareholder, Guangzhou Automobile Industry Group, have signed a strategic cooperation framework that could reshape Toyota's long-standing...
Friday 2 October 2026
Hygon, Sugon deepen integration under one chairman after US$17.3B merger collapse

Chinese AI chipmaker Hygon Information Technology has appointed Jun Li as its new chairman following a recent board reshuffle. Li only took over...

Friday 2 October 2026
Samsung launches Tab S12, Buds On, SmartTag3
Samsung Electronics on October 1 unveiled its next-generation premium Galaxy Tab S12 series, its first clip-on wireless earbuds, the Galaxy Buds On, and the Galaxy SmartTag3, which...
Friday 2 October 2026
Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle
Japan's three major power semiconductor makers — Rohm Semiconductor, Toshiba, and Mitsubishi Electric — have failed to complete integration talks on the original schedule,...
Friday 2 October 2026
SK Hynix says Solidigm IPO remains undecided as AI storage demand drives investment
SK Hynix has reiterated that no decision has been made on a potential US initial public offering (IPO) or other external financing for its Solidigm subsidiary, as the company weighs...
Friday 2 October 2026
GMI Cloud secures NT$14.05 billion loan for AI factory
CTBC Bank and GMI Cloud on October 1 announced the closing of an NT$14.05 billion (about US$445 million) syndicated credit facility to fund Taiwan's first AI factory. The deal is the...
Friday 2 October 2026
Swancor expands recycled materials, eyes recyclable carbon fiber for drone components
Swancor Holding subsidiary Swancor Regener is jointly exhibiting with Aeraxa Aerospace Technology at the Taichung AI and Smart Manufacturing Show in Taichung, Taiwan, showcasing products...