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Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
China's GenAI race shifts to open source ecosystems
The global GenAI race has remained intense, with major US players including Google, Meta, Microsoft, Amazon, and OpenAI investing heavily. But with Beijing-based startup Moonshot AI...
Wednesday 29 July 2026
Kumamoto quake hits electronics cluster, but impact remains concentrated in inspection-related stoppages
Electronics suppliers across Japan's Kumamoto semiconductor cluster halted production, evacuated employees, or began safety inspections after a magnitude 7.1 earthquake struck the...
Wednesday 29 July 2026
US blocks new foreign-made robots and power inverters in AI security crackdown

The US has barred new foreign-produced advanced robots and power inverters from receiving regulatory approval, extending its technology...

Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
Wednesday 29 July 2026
Samsung reportedly weighs Chinese DRAM for budget smartphones as memory inflation squeezes mobile market
Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget...
Wednesday 29 July 2026
Analysis: How Xiaomi's range-extended EV push could redraw China's supplier map

Xiaomi is preparing to unveil a new car technology platform on July 30, signaling a deeper move into the range-extended electric vehicle...

Wednesday 29 July 2026
Moonshot AI's Kimi K3 secures Day 0 support from Alibaba Cloud, Huawei Ascend

China's two major AI computing ecosystems moved quickly to support Kimi K3 after Moonshot AI released the large language model as open...

Wednesday 29 July 2026
TDK and LG Innotek form partnership on physical AI sensors
TDK and LG Innotek are joining forces to develop sensors for Physical AI, a move that could shape future robotics and automation products used worldwide. The collaboration combines...
Wednesday 29 July 2026
Huawei targets 2027 glass substrate production to gain an edge in AI chips

Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027,...

Wednesday 29 July 2026
Commentary: Why China's 2026 tech breakthroughs are a generational harvest

Judging only by the news of summer 2026, China's technology sector appears to have entered an unusually concentrated period of brea...

Wednesday 29 July 2026
OpenAI plans to test first hardware device in South Korea
OpenAI's CEO Sam Altman has said that the company may use South Korea as a testbed for its first hardware device, widely believed to be a screenless speaker. However, it remains to...
Wednesday 29 July 2026
From Silicon Valley to Sicily: Samsung, SK chiefs take Korea's AI supply-chain pitch to Google Camp

A high-level technology gathering in Sicily, reportedly to be attended by the leaders of two of South Korea's largest semiconductor...

Wednesday 29 July 2026
China rejects US AI model theft claims, says American firms distill Chinese models too
China's Ministry of Commerce has rejected US allegations that Chinese artificial intelligence companies used model distillation to acquire capabilities from advanced US AI models,...
Wednesday 29 July 2026
SK Telecom bets on AI infrastructure to regain core status in SK Group
SK Telecom is moving to reposition itself as an AI infrastructure platform as it tries to recover its standing inside SK Group. The South Korean carrier's shift comes as domestic telecom...