中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
    1min ago
    Exclsuive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
    Jul 16, 17:49
    Apple price hikes raises questions for device upgrade timing
    Jul 16, 17:49
    Commentary: ASML's race to catch u p shows AI's real bottleneck isn't chips — it's cleanrooms
    Jul 16, 17:49
    China reveals first official commercial space member list, backing mature players and NTN chain
    Jul 16, 17:49
    NEWS TAGGED EAST ASIA
    Friday 17 July 2026
    Moonshot's free Kimi K3 matches Anthropic's Opus 4.8, closing the gap between open and proprietary AI
    Chinese AI developer Moonshot AI released Kimi K3 on July 16, a 2.8-trillion-parameter model the company bills as the first open model in the roughly 3-trillion-parameter class, pushing...
    Friday 17 July 2026
    China auto sales slump deepens as exports face rising trade scrutiny
    China's passenger vehicle market posted its sharpest slowdown in years in the first half of 2026, with private passenger car sales falling 20% year on year, according to the China...
    Friday 17 July 2026
    Australia strips voting rights from China-linked holdouts in rare-earths miner, curbing Beijing's mineral leverage

    Australia has escalated a two-year campaign to force Chinese investors out of Northern Minerals Ltd., barring three China-linked shareholders...

    Friday 17 July 2026
    South Korean bill could let SK Hynix bring in outside investors for new fabs

    A South Korean lawmaker has introduced a bill that would allow a second-tier subsidiary of a general holding company to retain a stake...

    Friday 17 July 2026
    China's AI chips hit three walls — and bet on 3D memory to break through
    China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
    Thursday 16 July 2026
    TSMC says 2nm has four times as many tape-outs as 3nm at the same stage
    Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production...
    Thursday 16 July 2026
    DeepSeek eyes US$70 billion valuation and Shanghai IPO as Apple Intelligence enters China

    DeepSeek is preparing a new fundraising round and a possible Shanghai listing as surging computing costs force one of China's best-known...

    Thursday 16 July 2026
    Apple Intelligence edges closer to China with Alibaba Qwen integration
    Apple Intelligence has passed a key regulatory milestone in China, bringing the iPhone maker closer to launching generative AI features for mainland users after a prolonged delay.
    Thursday 16 July 2026
    CXMT IPO raises fresh capital, but its own prospectus map shows distance still to close
    The IPO prospectus filed by Changxin Memory Technologies (CXMT) ahead of its planned listing on Shanghai's STAR Market offers an unusually candid portrait of the global DRAM industry...
    Thursday 16 July 2026
    Samsung turns to titanium to reduce screen creases in next foldables
    Samsung Electronics unveiled a new titanium-based display structure on July 15, designed to reduce screen crease visibility while improving durability and preserving a slim profile...
    Thursday 16 July 2026
    Commentary: Xi Jinping elevates Sovereign AI, diplomacy, ecosystems into China's next AI strategy

    The 2026 World Artificial Intelligence Conference (WAIC) opens in Shanghai on July 17, with Chinese President Xi Jinping set to attend...

    Thursday 16 July 2026
    Hanmi, Hanwha clash in court over HBM equipment patents
    Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...
    Thursday 16 July 2026
    LG Electronics ramps up actuator hiring as AXIUM production starts early
    LG Electronics is expanding hiring for its robotic actuator business after reportedly starting AXIUM production months ahead of schedule, as the South Korean company builds the development,...
    Thursday 16 July 2026
    China's TPU path gains traction with low-cost AI inference challenging GPU economics

    Generative AI applications are expanding rapidly, making computing costs a growing bottleneck to commercial AI deployment. The AI accelerator...

    Thursday 16 July 2026
    Samsung weighs outsourcing Google TPU back-end design as 2nm demand grows

    Samsung Electronics is considering outsourcing some or all of the back-end design work for an input/output die in Google's reported...

    1/240 pages
    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    reportAIglasses