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Thursday 10 September 2026
China sets clear limits on payment terms to auto suppliers
China's government is formally imposing rules on long payment terms in the auto supply chain, with the Ministry of Industry and Information Technology (MIIT) and the State Administration...
Thursday 10 September 2026
DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices
Chinese AI startup DeepSeek has taken a concrete step toward a domestic stock-market debut while continuing to adjust its commercial strategy, including another reduction in API prices...
Thursday 10 September 2026
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

Thursday 10 September 2026
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
Thursday 10 September 2026
DeepSeek's next AI test is not the model; it's everything around it

DeepSeek has opened roughly 150 positions in a new hiring round focused almost entirely on engineering and infrastructure, pointing to...

Thursday 10 September 2026
Phison pushes in-house AI solutions as August revenue surges to record high
Phison Electronics continues to benefit from the rapid growth in demand for artificial intelligence (AI) infrastructure, AI inference, and enterprise storage, with its Phison AI Data...
Thursday 10 September 2026
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth...
Thursday 10 September 2026
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic...
Thursday 10 September 2026
SK Hynix says 3D DRAM will borrow from logic foundry playbook
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
Thursday 10 September 2026
Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape
South Korea's science ministry has budgeted KRW250 billion (US$184.6 million) for 2027 to run "AI for all," a state-funded program that aims to give every citizen free access to chatbots...
Thursday 10 September 2026
China gets an early shot at the next SiC power-chip cycle

Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

Thursday 10 September 2026
Beyond the stage, can XPeng's EV playbook scale humanoid robots?
As humanoid robotics glides — in its own distinctive glamour — toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where...
Thursday 10 September 2026
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Thursday 10 September 2026
Samsung trims foundry partner network as remaining DSPs gain momentum
Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
Thursday 10 September 2026
Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs
The appeal of lithium-manganese-rich (LMR) batteries has long rested on a difficult proposition: delivering relatively high energy density without carrying the same material costs...