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Thursday 4 June 2026
HBM4 supply in focus as SK's Chey meets TSMC's Wei
SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Thursday 4 June 2026
Exclusive: How China's subsidized SiC boom is driving global prices to the floor
China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping...
Thursday 4 June 2026
Huawei's MineHarmony OS links 935 mining devices in China's smart mining push
Huawei's MineHarmony (Mine Harmony OS), a mining-focused industrial Internet of Things operating system jointly developed with China Energy Group, has surpassed 200 ecosystem partners...
Thursday 4 June 2026
BOE races Samsung for Gen 8.6 OLED title despite low yield

BOE is preparing to hold a mass-production shipment ceremony for its Gen 8.6 IT OLED line in mid-June, positioning the Chinese display...

Thursday 4 June 2026
Japan's robotics legacy faces a new challenge: commercial success
At the close of his keynote address at the Humanoids Summit in Tokyo, Hiroshi Ishiguro — one of the pioneers of humanoid robotics — offered a candid assessment of the industry's...
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs...

Thursday 4 June 2026
Kioxia weighs new NAND fab as AI demand drives long-term expansion plans
Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company...
Thursday 4 June 2026
Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron,...
Wednesday 3 June 2026
NAND market hits record as YMTC closes in on global rivals
The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and...
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
Wednesday 3 June 2026
BYD is building its own chips and looking abroad to make them

China's electric vehicle (EV) makers are increasingly designing their own artificial-intelligence (AI) chips. Manufacturing them, however,...

Wednesday 3 June 2026
Samsung Foundry eyes Anthropic as OpenAI chip project reportedly stalls

Samsung Electronics is seeking to secure major artificial intelligence (AI) logic-chip customers as its reported preliminary work on...