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Wednesday 27 May 2026
Unitree sprints toward IPO as profits crumble under rising costs
Chinese humanoid robot maker Unitree Robotics is moving quickly toward an initial public offering, but its latest prospectus points to the commercial challenges still facing the se...
Wednesday 27 May 2026
Facing Chinese rivals, Hyundai accelerates robotaxi plans and cost cuts
As Chinese automakers intensify a global price war, South Korea's Hyundai Motor Group is responding on two fronts at once: accelerating its push into autonomous mobility while pressing...
Wednesday 27 May 2026
Qualcomm and ByteDance's rumored AI ASIC deal signals potential shift in China's data center chip supply
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain...
Wednesday 27 May 2026
China clears 9 domestic AI chips for state procurement
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology...
Wednesday 27 May 2026
Samsung wage deal pushed through by chip workers, widening bonus divide
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide...
Wednesday 27 May 2026
Luxshare projects multi-year AI infrastructure surge while flagging energy and standards challenges
Luxshare Precision Industry said at its annual shareholders meeting on May 22 that it expects AI infrastructure to expand strongly over the next three to five years. Still, it warned...
Wednesday 27 May 2026
Former Tencent AI lead says Chinese firms are trailing US on core LLM innovation
A former Tencent large-model technical chief warned that Chinese artificial intelligence companies lack independent paradigm-level breakthroughs and are trailing US rivals, according...
Wednesday 27 May 2026
China tightens drone, flying-car rules as low-altitude market takes off

China is building a more formal safety and regulatory framework for its low-altitude economy, as drones, electric vertical takeoff and...

Wednesday 27 May 2026
SK Hynix seeks to embed cooling inside HBM to beat the heat
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
Wednesday 27 May 2026
TSMC and Micron's fabs expanding; how do Samsung and SK Hynix's bonus systems come into play?
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement...
Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
Tuesday 26 May 2026
Inside China's chip war: How Xiaomi, BYD, and Nio are rewriting the rules
China's semiconductor war has been underway for seven or eight years now.
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
Tuesday 26 May 2026
Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...