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Friday 27 March 2026
Japanese automakers diverge: EV retreat vs. hydrogen ambition

Sony Honda Mobility, the joint venture between Sony and Honda, has scrapped the two "Afeela"-branded electric vehicles it had been developing,...

Friday 27 March 2026
Samsung and SK Hynix expand microscope procurement to boost HBM yield
As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...
Thursday 26 March 2026
Commentary: TSMC chairman exposes three realities behind China's robot FOMO
When TSMC chairman C.C. Wei recently dismissed the hype around Chinese robots as "just for show," it sparked heated debate across the tech sectors on both sides of the Taiwan Strait...
Thursday 26 March 2026
South Korea freezes 2Q26 electricity rates, amplifying stress on pricing mechanism and future bills
South Korea will keep electricity rates unchanged for the second quarter of 2026 amid geopolitical tensions in the Middle East, which are pushing global energy prices higher, a decision...
Thursday 26 March 2026
SEMICON China opens with focus on AI chips and advanced packaging
SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
Thursday 26 March 2026
China's H3C expands server exports to ASEAN and Central Asia as global AI compute demand rises
As countries tighten controls on advanced chips and AI computing demand surges, how China secures compute resources matters globally. DIGITIMES Research reports H3C, a top Chinese...
Thursday 26 March 2026
Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge
Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul...
Thursday 26 March 2026
China's Naura and AMEC lead China's push into advanced chip packaging
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...
Wednesday 25 March 2026
Denso proposes acquisition of Rohm to strengthen automotive and power control
Automotive parts giant Denso, closely linked with Toyota Motor, has officially submitted a proposal to acquire shares in Rohm Semiconductor, signaling its clear intent to pursue a...
Wednesday 25 March 2026
With Hua Hong partnership, STMicro builds 'China for China' supply chain
STMicroelectronics said this week that its STM32 microcontrollers, produced in partnership with Hua Hong Semiconductor, have entered volume production in China and are now being shipped...
Wednesday 25 March 2026
'China Speed': the new benchmark in global auto competition
Through highly centralized supply chains, a software-first development philosophy, and extensive state subsidies, Chinese automakers have compressed traditional vehicle development...
Wednesday 25 March 2026
China-South Korea panel war escalates: USPTO rejects Tianma patent challenge
The US Patent and Trademark Office has rejected an attempt by Tianma Microelectronics to challenge a patent held by LG Display, citing concerns that the Chinese company may be under...
Wednesday 25 March 2026
SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech
SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin...
Wednesday 25 March 2026
Samsung reportedly set to begin GaN foundry production, prepare SiC samples
Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon...