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Monday 24 November 2025
NGK Insulators to expand capacity for chiplet ceramic support wafers that offer 5x warpage resistance
Japanese ceramics firm NGK Insulators has announced plans to triple its production capacity of support wafers by fiscal year 2027 (April 2027-March 2028). More specifically, these...
Monday 24 November 2025
Doosan poised to secure exclusive Nvidia Rubin CCL supply as EMC fails GB300 test
Doosan Electronic Business Group (Doosan Electro-Materials) is on track to become the exclusive supplier of copper-clad laminate (CCL) for Nvidia's next-generation AI chip, Rubin,...
Sunday 23 November 2025
SK Hynix reportedly plans to boost 1c DRAM output eightfold in 2026
SK Hynix is reportedly preparing a major ramp-up of its next-generation 1c DRAM production, with plans to increase capacity eightfold in 2026 to meet rising demand for high-performance...
Sunday 23 November 2025
Intel's China debut highlights AI expansion, Gaudi 2E, and disaggregated supernodes
The 2025 Intel Technology Innovation and Industry Ecosystem Conference was held from November 19 to 21, 2025, in Chongqing, China. At the event, Intel CEO Lip-Bu Tan and newly appointed...
Saturday 22 November 2025
Foxconn activates Model A for Japan, forecasting bigger CDMS impact by 2026
Electric vehicles continued to dominate Hon Hai Tech Day (HHTD25) this year, with Foxconn unveiling a fully realized version of its Model A concept and framing the project around...
Saturday 22 November 2025
South Korea's KT Sat calls for a national sovereign network amid megaconstellation dominance
As control of the low-Earth-orbit satellite market consolidates among a small number of global operators, KT Group's satellite arm, KT Sat, has issued a warning that South Korea must...
Friday 21 November 2025
Nexperia shockwaves hit auto industry as Europe and Japan slash output

The Dutch government recently suspended its administrative order against Nexperia and returned control of the chipmaker to its Chinese...

Friday 21 November 2025
Foxconn unveils Model A EV platform tailored for Japan's mobility market
On the opening day of Hon Hai Tech Day, Foxconn introduced a new reference EV, the Model A—its most concentrated focused push yet to tailor electric vehicles for specific industries...
Friday 21 November 2025
TSMC in sight: Samsung seen hitting 21,000 wafers by 2026
Samsung Electronics is reportedly planning to raise the monthly output of its next-generation 2nm foundry process to as many as 21,000 wafers by the end of 2026, according to new...
Friday 21 November 2025
SoftBank sets up US$3bn Ohio plant for OpenAI's modular AI infrastructure
SoftBank Group plans to invest up to US$3 billion to turn a former electric-vehicle plant in Lordstown, Ohio, into a manufacturing hub for OpenAI's modular AI data-center hardware...
Friday 21 November 2025
Mitsubishi Fuso charts new course with safety and zero-emission buses
Mitsubishi Fuso Truck and Bus Corporation (MFTBC) is drawing on its nine decades of experience as it seeks new opportunities in the global bus market. According to Katsuto Kora, director...
Friday 21 November 2025
Lenovo seals DRAM and NAND pacts to stay ahead of 2026 price surge
Lenovo expects memory costs to stay high in 2026, but unlike many PC and smartphone makers, it says long-term supply is already secured. CEO Yang Yuanqing confirmed that Lenovo has...
Friday 21 November 2025
China's IC design surge heads for US$100bn milestone in 2025
China's chip-design boom is accelerating despite US export controls, with demand for domestic semiconductors rising sharply. With advanced-node restrictions still in force, Chinese...
Friday 21 November 2025
Huawei lifts Shenzhen to China's No. 2 chip design hub

China's latest IC design forecast projects Shenzhen's chip design revenue will reach CNY204.23 billion (approx. US$28.7 billion) in 2025,...

Friday 21 November 2025
South Korean tech giants rush into glass substrates despite mounting fears of overinvestment
South Korea's largest conglomerates are pouring resources into glass substrates, a next-generation semiconductor packaging material that promises better thermal stability and power...