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Monday 21 September 2026
Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV
This week's reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk's unusual engineering push in Korea and Google's...
Monday 21 September 2026
Samsung reportedly cuts QD TV output 80% as Neo QLED phaseout looms

Samsung Electronics will reportedly slash quantum-dot (QD) LCD TV production in 2026 to 2 million to 3 million units, down as much as...

Monday 21 September 2026
CHT completes 4th Taiwan-Matsu subsea cable, boosting offshore resilience

Chunghwa Telecom (CHT) announced on September 18 that the nearly 300km-long Taiwan-Matsu submarine cable has been completed, landed,...

Monday 21 September 2026
ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth

ACM Research Shanghai is staking its growth case on two developments: planned tool installations at customers outside mainland China...

Sunday 20 September 2026
AI capacity crunch drives up consumer tech costs, deepening China's deflation
Surging AI server demand is reshaping consumer electronics. Memory costs have risen sharply this year, prompting Huawei, Oppo, Xiaomi and Apple to raise prices on some smartphones...
Sunday 20 September 2026
Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership

German commercial vehicle company Quantron and China's Hongjing Drive have formally agreed to establish a joint venture, Quantron China,...

Saturday 19 September 2026
MediaTek, Vivo bring 30B MoE models on-device in next AI phone race

MediaTek's new Dimensity 9600 Pro puts agentic AI at the center of its flagship smartphone strategy, supporting on-device mixture-of-experts...

Saturday 19 September 2026
Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise
It has become increasingly evident that one of the factors undermining China's unparalleled competence in the global EV industry is manufacturing scale. But the continued development...
Saturday 19 September 2026
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...

Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...

Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials,...
Friday 18 September 2026
Doosan commits KRW968 billion to CCL expansion as demand strains capacity
Doosan is investing KRW968.4 billion (approx. US$701 million) to expand high-end copper-clad laminate (CCL) production in South Korea and China, its largest-ever investment in the...
Friday 18 September 2026
China's AI data center token costs hinge on access to advanced GPUs
China's AI data centers are confronting a severe chip access bottleneck, with the cost of producing tokens shaped less by model design than by geopolitics, according to a recent Caijing...
Friday 18 September 2026
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung...

Friday 18 September 2026
High-end GPUs may be slowing China's AI compute expansion
China's wide gap in token costs stems largely from domestic companies' difficulty in accessing Nvidia high-end GPUs, forcing them to squeeze more value from each token to recoup costs...