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NEWS TAGGED COF
Monday 17 June 2019
Chipbond to suspend 5G PA packaging capacity expansion
Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...
Thursday 13 June 2019
JMC finds strength to compete with bigger rivals
Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...
Wednesday 12 June 2019
JMC expects flat growth or slight decrease in 3Q19 revenues
Chip-on-film (COF) substrate suppliers JMC Electronics expects to post flat growth or a slight decrease sequentially in third-quarter revenues, due to a cutback in orders in the wake...
Tuesday 4 June 2019
COF packaging demand for smartphones remains promising
Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...
Friday 31 May 2019
COF packaging sees demand emerging for automotive OLED displays
COF packaging demand for automotive OLED displays has emerged, which may further tighten market supply as capacity expansion will remain quite limited in the short term, according...
Tuesday 21 May 2019
Taiwan IC partners see unclear prospects for 2H19 shipments to Huawei
With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...
Friday 3 May 2019
Huawei demanding more COF substrate supply
Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...
Wednesday 24 April 2019
Zhen Ding to start shipping automotive PCB in 2019
Zhen Ding Technology is expected to begin shipments of its rigid-flex PCBs for automotive camera modules later in 2019, according to industry sources. The PCB manufacturer will start...
Thursday 11 April 2019
Chipbond to land COF packaging orders for 2019 LCD iPhone, say sources
Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk...
Tuesday 9 April 2019
Backend firms see significant pickup in orders for TDDI chips
Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...
Tuesday 2 April 2019
COG packaging demand picking up
COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...
Tuesday 2 April 2019
Zhen Ding to see non-FPCB products account for over 20% of 2019 revenues
Flexible PCB specialist Zhen Ding Technology will see sales of its non-FPCB products including substrate-like PCBs and rigid-flex boards to account for more than 20% of company revenues...
Wednesday 20 March 2019
Taiwan panel and driver IC firms to form COF substrate JV
Speculation has circulated recently in Taiwan's industry about a new company that will be set up jointly by the local LCD panel and driver IC companies to specialize in the manufacture...
Tuesday 19 March 2019
COF substrate prices to rise 8-15% in 2Q19
COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.
Wednesday 6 March 2019
Machvision posts revenue growth in February
Automated optical inspection (AOI) equipment specialist Machvision saw its consolidated revenues for February 2019 increase 14.2% on year and 2.9% sequentially to NT$212 million (US$6.87...