Wednesday 9 January 2019
Chipbond, JMC post revenue growth in 2018
Chipbond Technology and JMC Electronics, both of whom are among the world's few suppliers of COF substrates, have reported revenue increases for 2018 of 16% and 45%, respectively.
Tuesday 18 December 2018
ChipMOS looks to COF packaging, automotive electronics for 2019 growth
Chip-on-film (COF) packaging demand for panel-use driver ICs, demand for memory chips including niche-market DRAM and automotive NOR flash, and demand for automotive touch and display...
Wednesday 12 December 2018
IC materials distributors to end 2018 with notable revenue increases
Taiwan-based IC fabrication and packaging material distributors including Topco Scientific, Niching Industrial and Wahlee Industrial are expected to end 2018 with impressive annual...
Monday 19 November 2018
COF substrates have high entry barrier, says JMC chairman
The chip-on-film (COF) substrate market continues to be dominated by Korea- and Taiwan-based firms, and is considered to be niche with a high barrier of entry for startup companies,...
Thursday 8 November 2018
JMC enjoys robust COF substrate orders for Android smartphones
JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, has enjoyed robust orders for Android smartphones...
Thursday 1 November 2018
Chipbond posts record 3Q18 profit
LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
Thursday 18 October 2018
Chipbond enters Huawei smartphone supply chain
Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.
Wednesday 22 August 2018
Driver IC backend firms ink 3-year supply contracts
Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
Tuesday 24 July 2018
Orders for OLED driver ICs to boost Chipbond revenues in 2019-2020
Taiwan-based backend firm Chipbond Technology is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019...
Wednesday 27 June 2018
ChipMOS seeing COF packaging capacity run at full utilization
ChipMOS Technologies has seen its COF (chip-on-film) packaging production capacity run at full utilization, thanks to strong demand for TDDI (touch and display driver integration)...
Tuesday 26 June 2018
COF packaging substrate, service suppliers bracing for strong sales in 2H18
Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
Wednesday 20 June 2018
Chipbond thinks COF crucial for packaging smartphone driver ICs
The most important evolution in the LCD driver IC packaging sector in 2018 is that the COF (chip on film) package process has become a crucial alternative to COG (chip on glass) for...
Tuesday 15 May 2018
ChipMOS obtains NT$12 billion syndicated loan
Backend house ChipMOS Technologies has signed a five-year syndicated loan for NT$12 billion (US$401.4 million) with 11 local banks in Taiwan, according to a company filing with the...
Tuesday 20 March 2018
COF demand to receive boost in 2H18, says JMC
Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
Friday 16 March 2018
ChipMOS optimistic about COF packaging, demand for NOR and niche-market DRAM
ChipMOS Technologies expects to see tight production capacity for COF (chip-on-film) packaging in 2018, and is optimistic about demand for NOR flash and niche-market DRAM memory.
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