Tuesday 21 May 2019
Taiwan IC partners see unclear prospects for 2H19 shipments to Huawei
With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...
Friday 3 May 2019
Huawei demanding more COF substrate supply
Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...
Wednesday 24 April 2019
Zhen Ding to start shipping automotive PCB in 2019
Zhen Ding Technology is expected to begin shipments of its rigid-flex PCBs for automotive camera modules later in 2019, according to industry sources. The PCB manufacturer will start...
Thursday 11 April 2019
Chipbond to land COF packaging orders for 2019 LCD iPhone, say sources
Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk...
Tuesday 9 April 2019
Backend firms see significant pickup in orders for TDDI chips
Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...
Tuesday 2 April 2019
COG packaging demand picking up
COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...
Tuesday 2 April 2019
Zhen Ding to see non-FPCB products account for over 20% of 2019 revenues
Flexible PCB specialist Zhen Ding Technology will see sales of its non-FPCB products including substrate-like PCBs and rigid-flex boards to account for more than 20% of company revenues...
Wednesday 20 March 2019
Taiwan panel and driver IC firms to form COF substrate JV
Speculation has circulated recently in Taiwan's industry about a new company that will be set up jointly by the local LCD panel and driver IC companies to specialize in the manufacture...
Tuesday 19 March 2019
COF substrate prices to rise 8-15% in 2Q19
COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.
Wednesday 6 March 2019
Machvision posts revenue growth in February
Automated optical inspection (AOI) equipment specialist Machvision saw its consolidated revenues for February 2019 increase 14.2% on year and 2.9% sequentially to NT$212 million (US$6.87...
Monday 25 February 2019
Development of foldable smartphones by non-Samsung players to benefit Taiwan supply chain
The planned launch of foldable smartphones by vendors other than Samsung Electronics such as Huawei and other Chinese brands, will benefit Taiwan's supply chain makers related to...
Monday 25 February 2019
Chipbond revenues to surge in 2Q19
Chipbond Technology, a backend house specializing in display driver ICs, is expected to see its revenues buck seasonal patterns in the first quarter of 2019 followed by robust performance...
Tuesday 19 February 2019
Zhen Ding revenues plummet in January
Zhen Ding Technology, reportedly among the flexible PCB suppliers for Apple's iPhones, saw its revenues for January 2019 plummet 20.57% on month and 38.02% on year to NT$7.50 billion...
Tuesday 19 February 2019
Taiwan backend firms gearing up for robust demand for COF packaging
Taiwan-based backend houses are expected to ramp up production capacity for chip-on-film (COF) packaging in the third quarter of 2019 to satisfy growing demand for smartphone panel...
Monday 14 January 2019
Topco, Wahlee see revenues surge over 20% in 2018
Semiconductor material distributors Topco Scientific and Wahlee Industrial have both reported on-year increases in consolidated revenues for 2018 of 21.4% and 23.4%, respectively.
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Summary of Tech Supply Chain News!
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