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Monday 15 September 2025
Google eyes Nvidia's turf with new TPU-as-a-service model

In a significant strategic pivot, Google is preparing to move its custom-built Tensor Processing Units (TPUs) beyond its own cloud infrastructure—marking...

Sunday 14 September 2025
From slides to silicon: India's Suchi Semicon shows progress in chip packaging
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
Friday 12 September 2025
SEMICON Taiwan 2025: CHPT enters US CSP supply chain; order visibility extends to 3Q26
Taiwanese test interface manufacturer CHPT showcased its latest innovations at SEMICON Taiwan 2025. Besides unveiling a comprehensive upgrade solution centered on "AI-driven probe...
Friday 12 September 2025
Advantest tops TEL in market value after 19 years, driven by AI chip testing boom
Japanese chip testing equipment giant Advantest has overtaken Tokyo Electron (TEL) in market capitalization for the first time in nearly two decades, signaling a shift in the balance...
Friday 12 September 2025
SEMICON Taiwan 2025: IBM's roadmap for semiconductor and quantum development extends through 2042
At a SEMICON Taiwan forum on Quantum computing, IBM Japan CTO and Vice President Norishige Morimoto detailed how AI's growing complexity—estimated to have surged by more than...
Friday 12 September 2025
Huawei, Cambricon AI chip production set to top one million units by 2026
China is accelerating its drive for homegrown AI semiconductors. JPMorgan forecasts Huawei will ship 600,000–650,000 AI chips in 2025, while Cambricon Technologies is on track...
Thursday 11 September 2025
SEMICON Taiwan 2025: Tenstorrent's Jim Keller advocates for democratizing AI chip development with RISC-V
Renowned chip architect Jim Keller was invited to speak at the SEMICON Taiwan 2025 Master Forum. At the start of his speech, Keller announced that his company, Tenstorrent, will establish...
Thursday 11 September 2025
Shenzhen Dual-expo Spotlight | China leans on laser chips to localize AI data centers and bypass tariffs
The China International Optoelectronic Exposition (CIOE) and SEMI-e 2025 Semiconductor Innovation Exhibition kicked off in Shenzhen on September 10, underscoring the laser industry's...
Thursday 11 September 2025
Apple reduces reliance on Broadcom with in-house N1 chip for iPhone 17
Apple has reached a new milestone in its self-developed chips. Following the A and M series processors, as well as the debut of the C1 modem chip on the iPhone 16e in early 2025,...
Thursday 11 September 2025
Samsung eyes xAI chip partnership following major Tesla deal
After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...
Wednesday 10 September 2025
Google leads cloud AI race with advanced TPU chips, says industry insiders
Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...
Wednesday 10 September 2025
Broadcom offers US$600M incentive to CEO for AI business growth
Broadcom CEO Hock Tan stands to receive up to US$600 million in stock rewards if he can drive artificial intelligence (AI) product revenue to US$120 billion by fiscal year 2030.
Wednesday 10 September 2025
AI chip demand drives future semiconductor growth trends
SEMICON Taiwan 2025 opened on September 10, with numerous forums already underway ahead of the event. Various research institutions have expressed cautiously optimistic views on the...
Wednesday 10 September 2025
Taiwan pushes immersion cooling, CoWoS tech into US AI server supply chain
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Tuesday 9 September 2025
Malaysian IC design house Oppstar and Inventec to develop AI chips together
Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...