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    Tuesday 15 September 2026
    Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects

    The 2026 China International Optoelectronic Exposition (CIOE) closed with 800G and 1.6T optical modules still dominating the show floor,...

    Tuesday 15 September 2026
    The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
    "He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
    Monday 14 September 2026
    DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
    ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
    Monday 14 September 2026
    China accelerates e-SIM's leap from wearables to smartphones
    China's e-SIM adoption is moving beyond smartwatches and other wearables into smartphones at an accelerating pace.
    Monday 14 September 2026
    AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand
    Taiwan's semiconductor testing supply chain continued to ride strong AI and high-performance computing (HPC) demand in August 2026, with all four major suppliers posting year-over-year...
    Saturday 12 September 2026
    Murata targets mass production of its AI power substrate next year
    Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
    Friday 11 September 2026
    Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
    Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...
    Friday 11 September 2026
    CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
    Automotive optical-module demand could approach the scale of the established FTTx market by around 2030 as increasingly data-intensive vehicles shift high-bandwidth connections from...
    Friday 11 September 2026
    AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
    Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
    Friday 11 September 2026
    Apple makes the hinge, not the screen, the centerpiece of its first foldable
    Apple has built its first foldable around a component nobody sees. The iPhone Duo, unveiled 9 September and on sale from 23 October at a starting price of US$1,999, is defined less...
    Friday 11 September 2026
    Taiwan startup taps CMOS infrared chips to give robots an electronic 'nose'

    Breaking from the industry's mainstream reliance on III-V compound semiconductors, Taiwanese startup Taiwan Nano & Micro-Photonics...

    Thursday 10 September 2026
    STMicroelectronics sets 2027 AI revenue plan with fiber chips at 80%
    STMicroelectronics said in New York on September 9 that about 80% of its target for more than US$2 billion in artificial intelligence data-center revenue in 2027 will come from fiber-optic...
    Thursday 10 September 2026
    TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

    TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated...

    Thursday 10 September 2026
    Phison pushes in-house AI solutions as August revenue surges to record high
    Phison Electronics continues to benefit from the rapid growth in demand for artificial intelligence (AI) infrastructure, AI inference, and enterprise storage, with its Phison AI Data...
    Thursday 10 September 2026
    JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
    JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic...
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    BIZ FOCUS
    Sep 24, 08:00
    FSP Debuts World's First 80 PLUS Ruby ATX PSU
    Wednesday 23 September 2026
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AT&S Unveils Strategy to Drive AI Growth
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