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Tuesday 2 September 2025
Alibaba denies massive Cambricon chip order
Alibaba Group is reportedly making progress in its development and supply strategies for AI chips. There are mixed reports regarding the company’s procurement of computing power...
Monday 1 September 2025
DeepSeek fuels return to profit for Chinese tech champion Huawei
Huawei Technologies Co. posted a first-half profit, getting back into the black after the emergence of DeepSeek ignited a wave of AI development across China.
Monday 1 September 2025
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
TSMC plans to increase foundry prices for its advanced semiconductor processes by approximately 5% to 10% in 2026, according to sources in the IC design industry.
Friday 29 August 2025
South Korean media points to TSMC as main cause of Samsung's AP procurement cost surge
Samsung Electronics' smartphone division is reportedly struggling with escalating cost pressures, largely attributed to the rapid rise in prices for mobile application processors...
Friday 29 August 2025
Horizon Robotics cements lead in China's auto driving chips, eyes full autonomy within a decade
China's fast-growing autonomous driving market has cemented Horizon Robotics as the country's leading automotive chip supplier. The company posted first-half 2025 revenue of CNY1.567...
Friday 29 August 2025
Commentary: Cambricon soars on Nvidia’s China absence, but bubble risks loom
Nvidia projected third-quarter fiscal 2026 revenue of about US$54 billion, beating market consensus but trailing the most optimistic forecasts of US$60 billion. Crucially, the outlook...
Friday 29 August 2025
China reportedly plans to triple AI chip output by 2026, with 3 fabs for Huawei
China is preparing to triple its domestic AI chip production by 2026, according to people cited by the Financial Times. Three new wafer fabs...
Friday 29 August 2025
AI demand and state backing lift China's semiconductor rally

Shares of Chinese semiconductor firms rallied after a wave of strong half-year earnings, highlighting how Beijing's AI push is reshaping...

Thursday 28 August 2025
Analysis: Meta's US$10B Google Cloud deal highlights reliance amid chip and AI struggles
Meta Platforms has reportedly signed a six-year agreement worth US$10 billion with Google Cloud, marking an unprecedented partnership between two dominant companies in digital advertising...
Thursday 28 August 2025
Google's new TPU Ironwood delivers leap in computing power, integrating 9,216 chips
The AI infrastructure arms race is escalating at an unprecedented pace. At Hot Chips 2025, Google unveiled more details about its next-generation TPU platform, Ironwood, and how it...
Thursday 28 August 2025
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
Thursday 28 August 2025
Broadcom's 'open philosophy' tested: VMware-Nvidia alliance contrasts with chip rivalry
Broadcom, the ASIC powerhouse often cast as Nvidia NVLink's chief rival, hosted the VMware Explore conference in the US this week.
Thursday 28 August 2025
Nvidia warns on China H20 sales, clarifies Singapore billing
Nvidia faces uncertainty over H20 chip shipments to China despite strong second-quarter results
Thursday 28 August 2025
China’s cities outpace Beijing in AI chip race, setting steeper targets than the state
On August 25, Nikkei Asia reported that Shanghai aims to raise the domestic semiconductor share in AI and data center operations to more than 70% by 2027. Guizhou's Guiyang, in the...
Wednesday 27 August 2025
Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...