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Friday 12 September 2025
SEMICON Taiwan 2025: CHPT enters US CSP supply chain; order visibility extends to 3Q26
Taiwanese test interface manufacturer CHPT showcased its latest innovations at SEMICON Taiwan 2025. Besides unveiling a comprehensive upgrade solution centered on "AI-driven probe...
Friday 12 September 2025
Advantest tops TEL in market value after 19 years, driven by AI chip testing boom
Japanese chip testing equipment giant Advantest has overtaken Tokyo Electron (TEL) in market capitalization for the first time in nearly two decades, signaling a shift in the balance...
Friday 12 September 2025
SEMICON Taiwan 2025: Nvidia shifts optical roadmap from co-packaged to co-integrated optics
Nvidia is advancing its optical interconnect research to support the growing scale of "AI factories" and accelerated computing clusters.
Friday 12 September 2025
LGES plant shutdown crisis spreads nationwide
On September 6th, 2025, LG Energy Solution (LGES) faced a sudden raid by US national security and immigration authorities at its battery production base in the US. The joint venture...
Friday 12 September 2025
China's 10 memory firms post mixed 1H25: sales rise, profits lag
By September 2025, half-year earnings reports from 10 Chinese memory firms are in. Nine posted revenue growth, underscoring solid top-line momentum. Profitability, however, diverged...
Friday 12 September 2025
SEMICON Taiwan 2025: CCP Contact Probes' new semiconductor products expected to boost revenue
At SEMICON Taiwan 2025, CCP Contact Probes introduced three new products aimed at enhancing its presence in the semiconductor testing market: sockets, microelectromechanical system...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
Friday 12 September 2025
Yageo to acquire up to 28.5% stake in Anpec Electronics through public tender offer
Taiwan-based passive components manufacturer Yageo Corporation announced on September 11 that it plans to acquire up to 28.5% of power IC designer Anpec Electronics via a public tender...
Friday 12 September 2025
Infineon targets 2028 for RISC-V automotive chip rollout
At the OktoberTech Taipei event held on September 11, 2025, Infineon Technologies AG unveiled key developments in its automotive electronics portfolio, with CEO Jochen Hanebeck and...
Friday 12 September 2025
SEMICON Taiwan 2025: IBM's roadmap for semiconductor and quantum development extends through 2042
At a SEMICON Taiwan forum on Quantum computing, IBM Japan CTO and Vice President Norishige Morimoto detailed how AI's growing complexity—estimated to have surged by more than...
Friday 12 September 2025
SEMICON Taiwan 2025: Broadcom eyes CPO expansion beyond AI scale-out data centers
Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Friday 12 September 2025
US signals potential trade breakthrough with Taiwan and India amid ongoing tariff talks
US Commerce Secretary Howard Lutnick expressed optimism on September 11, 2025, that a significant trade deal with Taiwan is within reach, raising hopes that temporary tariffs on Taiwanese...
Friday 12 September 2025
Huawei, Cambricon AI chip production set to top one million units by 2026
China is accelerating its drive for homegrown AI semiconductors. JPMorgan forecasts Huawei will ship 600,000–650,000 AI chips in 2025, while Cambricon Technologies is on track...
Friday 12 September 2025
Huawei’s HiSilicon appoints new chairman after Eric Xu exit
Huawei Technologies senior executive Eric Xu has stepped down as the legal representative and chairman of subsidiary HiSilicon Semiconductor. He will be succeeded by Jeffrey Gao.