News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Sunday 26 July 2026

Podcast highlights: TSMC, SK Hynix, Intel face AI chip and cash flow inflection

This excerpt from DIGITIMES analyst Luke Lin's podcast covers two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...

Saturday 25 July 2026

SK Hynix and Nvidia strike long-term deal to co-develop next-generation HBM

SK Group and Nvidia have announced a comprehensive partnership valued at more than $500 billion, spanning AI factory construction and next-generation memory supply, with letters of...

Saturday 25 July 2026

Samsung, SK, Hyundai join Jensen Huang and Korea's President Lee at San Francisco AI Summit

South Korean President Lee Jae-myung and a delegation of the country's most powerful business leaders convened with NVIDIA founder and CEO Jensen Huang in Silicon Valley this week,...

Saturday 25 July 2026

89 fabs by 2030, 50 more by 2035: chip industry spreads risk through global collab

AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past...

Saturday 25 July 2026

Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy

Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...

Saturday 25 July 2026

Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum

Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...

Saturday 25 July 2026

Huaqin's growing stake in Nexchip shows ODMs reaching upstream into chipmaking

Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in Chinese foundry Nexchip Semiconductor, underscoring how contract...

Saturday 25 July 2026

NAND price rally enters plateau as supply stays tight despite weaker spot demand

The pace of NAND Flash price increases has moderated in the second half of 2026, prompting speculation that the memory market may be approaching a turning point. Supply-chain sources,...

Saturday 25 July 2026

Hisense expands AI strategy into energy, chips, and automotive electronics

Hisense outlined a broader AI strategy at its global partner conference in New York, saying it will expand beyond home appliances into semiconductors, smart energy, laser displays,...

Saturday 25 July 2026

Transcend posts record NT$11.9 billion profit in 2Q26, surpassing any prior full-year earnings

Memory module maker Transcend Information posted record-high profit in the second quarter and first half of 2026. Second-quarter consolidated revenue reached NT$18.82 billion (approx...

Saturday 25 July 2026

South Korea unveils AI cooperation agenda as Nvidia partnerships expand

South Korean President Lee Jae Myung launched an AI-focused visit to Silicon Valley by announcing a "San Francisco AI Declaration" aimed at promoting international cooperation in artificial...

Saturday 25 July 2026

South Korean leaders meet Nvidia as AI partnerships expand

South Korean President Jae Myung Lee, senior government officials, business executives, and researchers gathered in San Francisco this week for an AI summit with Nvidia and industry...

Saturday 25 July 2026

Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging

Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...

Friday 24 July 2026

SK Hynix seeks US engineers for 3D stacked DRAM push

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy...

Friday 24 July 2026

Huawei founder endorses Tau Law as sole path for post-Moore chip development

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor...

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