Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
US Commerce Secretary Howard Lutnick expressed optimism on September 11, 2025, that a significant trade deal with Taiwan is within reach, raising hopes that temporary tariffs on Taiwanese...
China is accelerating its drive for homegrown AI semiconductors. JPMorgan forecasts Huawei will ship 600,000–650,000 AI chips in 2025, while Cambricon Technologies is on track...
Huawei Technologies senior executive Eric Xu has stepped down as the legal representative and chairman of subsidiary HiSilicon Semiconductor. He will be succeeded by Jeffrey Gao.
Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
TSMC's plant in Kumamoto, Japan, is fueling deeper investment ties between Kyushu and Taiwan. On September 10, 15 semiconductor suppliers from Fukuoka and Kumamoto exhibited at SEMICON...
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
Taiwan's Minister of Economic Affairs Kung Ming-hsin, on September 10, 2025, declined to comment on an alleged trade secret theft targeting TSMC's 2nm process technology amid concerns...
Since the beginning of 2025, despite disruptions from US President Donald Trump's trade protectionism, the AI wave has driven American cloud service providers (CSPs) to continuously...
The Southern Taiwan Science Park (STSP) has continued to see its output value climb to new highs each year, underscoring its role as a key hub in the global semiconductor supply chain...
Jochen Hanebeck, CEO of Infineon, emphasized the concept "no AI without power" during his keynote speech at the SEMICON Taiwan 2025 Master Forum. Power semiconductors play a critical...
Winbond Electronics has implemented significant price increases for its DDR4 DRAM products beginning in the third quarter of 2025, with contract prices for the fourth quarter finalized...
Renowned chip architect Jim Keller was invited to speak at the SEMICON Taiwan 2025 Master Forum. At the start of his speech, Keller announced that his company, Tenstorrent, will establish...
Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
