Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component...

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial...

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry...

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...