中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Honda plans deeper China capacity cuts, closing in on Guangzhou and Wuhan
    12min ago
    OpenAI's HBM push signals a new AI memory arms race
    13min ago
    Lens Technology swings to loss on weak smartphone demand, FX pressure
    46min ago
    Commentary: Robots are selling, but profits are not; data is the real prize
    47min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 15 January 2026
    Taiwan accelerates drive to build silicon photonics ecosystem

    Taiwan's government is stepping up cross-ministerial support to build a domestic silicon photonics ecosystem, with a focus on strengthening...

    Thursday 15 January 2026
    China takes cautious stance on US H200 chip export, prioritizes local chipmakers
    The US government confirmed this week the conditions for exporting the H200 AI chip to China, reportedly including third-party lab testing before shipment to ensure compliance with...
    Thursday 15 January 2026
    CES 2026 insights: Taiwan IC designers push beyond consumer markets
    The 2026 Consumer Electronics Show (CES 2026) has concluded, with global IC design leaders including Nvidia, Qualcomm, and Advanced Micro Devices focusing on automotive and robotics...
    Thursday 15 January 2026
    TSMC forecasts nearly 30% revenue growth in 2026 as AI drives strong margins and capex surge
    TSMC held its earnings conference call on January 15, 2026, and guided for the first quarter. The company expects revenue to range between US$34.6–35.8 billion. Gross margin...
    Thursday 15 January 2026
    Chinese AI startup Z.ai unveils first multimodal model trained on Huawei Ascend chips
    Chinese artificial intelligence startup Z.ai, formerly known as Zhipu AI, has unveiled GLM-Image, a multimodal AI model trained entirely on Huawei's Ascend chip platform, marking a...
    Thursday 15 January 2026
    Samsung shifts to advanced nodes, 8-inch foundry capacity reportedly cut
    Samsung Electronics plans to shut part of its 8-inch foundry capacity in South Korea, as the company reallocates resources toward more advanced manufacturing, according to a report...
    Thursday 15 January 2026
    TSMC retains pricing power using Apple and AI dual structure
    Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
    Thursday 15 January 2026
    TSMC's 4Q25 revenue surges 20.5% on advanced process demand
    Taiwan Semiconductor Manufacturing Company (TSMC) reported consolidated revenue of approximately NT$1.4609 trillion (US$46.21 billion) and net income after tax of about NT$505.74 billion...
    Thursday 15 January 2026
    South Korea's memory chip giants pivot back to capacity expansion

    As the global memory market enters a prolonged upcycle, South Korea's two leading memory chipmakers, Samsung Electronics and SK Hynix,...

    Thursday 15 January 2026
    PlayNitride teams up with Brillink to build optical interconnect platform
    As Micro LED moves into non-display application opportunities, PlayNitride Technologies announced a partnership with Brillink Technologies, a leader in two-dimensional array optical...
    Thursday 15 January 2026
    Maxscend's first annual loss exposes fab-lite strain and legal risks
    Maxscend Microelectronics is heading for its first annual loss since going public, marking a sharp reversal for one of China's leading RF chipmakers as it struggles with a costly business...
    Thursday 15 January 2026
    ASML CEO claims China's EUV lags by 8 gen ahead of 4Q25 earnings
    ASML, the Dutch semiconductor equipment leader and exclusive supplier of EUV lithography systems, is set to release its fourth-quarter 2025 and full-year financial results on January...
    Thursday 15 January 2026
    Memory supply bottlenecks to drive PC price hikes and spec reductions through 2027
    Global memory shortages are expected to continue until late 2027, leading to higher costs for PCs, tablets, and smartphones. In an interview with The Register, IDC research...
    Thursday 15 January 2026
    Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows
    Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite...
    Thursday 15 January 2026
    Samsung reportedly files new HBM trademarks as HBM4 advances
    Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products.
    104/366 pages
    biz
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook