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Tuesday 21 July 2026
DDR5 module spot prices hit record highs as China-made dies narrow price gap
The pace of memory contract price increases has begun to slow in the second half of 2026, but DDR5 spot prices continue to climb as AI and server applications absorb available supply,...
Tuesday 21 July 2026
Phone prices to surge in 2H26 as low-end models fade

As the AI boom keeps memory shortages running hot, steep price hikes for smartphones in the second half of 2026 are coming into view...

Tuesday 21 July 2026
CMTX develops 590mm single-crystal silicon ground ring for chip etching

South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching...

Tuesday 21 July 2026
TSMC weighs margin hit against long-term AI payoff in US push

TSMC has announced an additional US$100 billion investment in the US on top of its existing US$165 billion commitment, expanding its...

Tuesday 21 July 2026
Li Auto reportedly forms new Shanghai chip company to expand in-house semiconductor ambitions
Chinese electric vehicle (EV) maker Li Auto has established a new subsidiary focused on IC chip design, underscoring its long-term strategy of developing core AI technologies in-ho...
Tuesday 21 July 2026
Taiwan indicts ex-TSMC employees in first China-linked national core tech espionage case

Taiwan prosecutors have indicted four former TSMC employees for allegedly stealing confidential semiconductor technology with the intent...

Tuesday 21 July 2026
AI reshapes semiconductor growth curve; Zeiss eyes US$2.5 trillion market
Generative AI, high-performance computing (HPC), and large AI models are rapidly reshaping the global semiconductor industry's growth curve. Thomas Stammler, chief technology officer...
Tuesday 21 July 2026
BOE expands into glass-core packaging, solar cells and optical interconnects
BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese...
Tuesday 21 July 2026
Niche demand drives SLC NAND prices up nearly tenfold, opening further gains for Taiwan suppliers
Memory price increases have begun to diverge in the second half of 2026, but persistent capacity shortfalls continue to constrain supply and sustain upward momentum in contract pri...
Tuesday 21 July 2026
How AI boom spurs Taiwan's PCB makers to rethink their Southeast Asia playbook

Amid the global boom in AI infrastructure investment, Southeast Asia is evolving from an electronics-component manufacturing base into...

Tuesday 21 July 2026
Pat Gelsinger: Intel missed GPU boom, warns Taiwan energy risk

Former Intel CEO Pat Gelsinger has criticized Intel's past strategy in a recent interview, revisiting the company's history with Nvidia...

Tuesday 21 July 2026
Memory shortage could turn into a glut by 2028 as chipmakers expand

A powerful rally in memory-chip stocks has stalled as investors reconsider whether record spending on AI data centers could eventually...

Tuesday 21 July 2026
Samsung keeps High-NA EUV rollout cautious as foundry profitability remains the focus

Samsung Electronics is taking a slower approach than Intel to High-NA extreme ultraviolet (EUV) lithography for advanced chip production,...

Tuesday 21 July 2026
TSMC sees structural AI growth, expands Arizona capex

TSMC Chief Financial Officer Wendell Huang said the company expects AI chip demand to remain strong for years, prompting it to keep...

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...