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Friday 19 September 2025
Samsung, Wolfspeed escalate silicon carbide race as EV and AI demand climbs
Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.
Friday 19 September 2025
Energy warning for Korea's semiconductor cluster: grid, LNG plans clash with net-zero goals
The Yongin Semiconductor Cluster in South Korea, which is anchored by Samsung Electronics and SK Hynix, is currently under development. However, experts caution that there are unresolved...
Friday 19 September 2025
SK Hynix's KRW100 million bonus lures Samsung talent
As SK Hynix kicks off its second-half 2025 recruitment drive with a generous bonus package, the move has generated significant buzz among Samsung Electronics employees, especially...
Friday 19 September 2025
Samsung gains edge as Micron falters on Nvidia's HBM4 demands
As Nvidia raises the performance threshold for fourth-generation high-bandwidth memory (HBM4), reports suggest that Micron Technology may be struggling to meet these standards. Industry...
Friday 19 September 2025
SiTime launches Titan timing chip for wearable devices
MEMS design company SiTime Corporation has introduced its new timing chip, Titan, aimed at the growing wearable device market. The new chip measures just 0.46mm by 0.46mm, significantly...
Friday 19 September 2025
STMicroelectronics to build PLP pilot line in Tours, aiming for 3Q26 production
STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with...
Friday 19 September 2025
Huawei's Ascend chips to surpass Nvidia's China-only GPUs with up to 8 PFLOPS, 14.4TB/s bandwidth
US export controls have capped the performance of Nvidia's "China-only" GPUs, opening the door for domestic chipmakers to compete. Huawei's Ascend roadmap, announced at its 2025 Connect...
Friday 19 September 2025
Nvidia-Intel partnership targets AI PCs, exposing limits of ATX
Nvidia and Intel have announced their collaboration to create custom CPUs and GPU-integrated system-on-chips (SoCs), as limitations posed by the size of GPUs and cooling requirements...
Friday 19 September 2025
Huawei Ascend 950 to feature in-house HBM in 2026, advancing China's AI memory independence
Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend...
Friday 19 September 2025
Alibaba's T-Head AI chip rivals Nvidia H20, wins major China Unicom data center deal
Alibaba's chip design arm T-Head has introduced its latest AI accelerator, the PPU, positioning it as a rival to Nvidia's China-only H20 GPU. The processor has already been rolled...
Friday 19 September 2025
Domestic AI chips forecast to capture over half of China's market by 2027
Once confined to gaming arcades, GPUs have transformed into the lifeblood of the AI revolution. Nvidia, the undisputed industry titan, wields what many call the "golden shovel" in...
Friday 19 September 2025
Imec CEO calls CMOS 2.0 the anchor for AI’s future

Dr. Luc Van den hove, president and CEO of Belgian research institute imec, used his keynote at SEMICON Taiwan 2025 to call for a global...

Friday 19 September 2025
Samsung and SK Hynix set stage for global battle over HBM4 chips

SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory...

Friday 19 September 2025
Analysis: After Nvidia invests in Intel, who's next?

Intel has secured another high-profile backer. Following earlier commitments from SoftBank and the US government, Nvidia has announced...

Friday 19 September 2025
Intel–NVIDIA alliance: what it means for TSMC, AMD, Arm and the wider industry

NVIDIA has announced it will invest US$5 billion in Intel, purchasing shares at US$23.28 each. The move surprised no one in the semiconductor...