News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Thursday 12 March 2026

ASE's Tien Wu: Taiwan leverages hardware strength as US chip rivalry intensifies

Given the global chip war and US-China rivalry, ASE Technology Holding COO Tien Wu says that in an era where AI is driving transformation in the technology industry, the new bottleneck...

Thursday 12 March 2026

ASE's Dr. Tien Wu shares three key trends as global semiconductor output to surpass US$1 trillion

The global semiconductor industry is set to hit US$1 trillion ahead of schedule. ASE Technology Holding COO Dr. Tien Wu revealed that the latest forecast from Semiconductor Equipment...

Thursday 12 March 2026

MediaTek bets on TSMC 3nm Genio Pro to serve high-end IoT needs while acknowledging limited demand

At Embedded World 2026, MediaTek unveiled the Genio Pro series, its flagship IoT platform built on TSMC's 3nm process, and said the market now requires both power-efficient mid-to-low-end...

Thursday 12 March 2026

SMIC flags supply squeeze in memory, BCD chips

China's largest contract chipmaker, SMIC, says orders for mature-node memory and BCD processes are running at full capacity, pushing prices higher as AI demand tightens supply across...

Thursday 12 March 2026

US-Iran clash seen as short-term shock as markets look toward possible de-escalation

The US-Iran military clash has raised concerns about oil supply disruptions and economic fallout. Still, hopes of a quick de-escalation have helped oil prices retreat and capital markets...

Thursday 12 March 2026

Compound semiconductors emerge as critical components in modern air defense radar systems, as seen during Iran conflict

Iran's air defense shortcomings amid persistent US and Israeli strikes underscore the growing importance of high-power radar components and the supply chains that provide them. South...

Thursday 12 March 2026

Nvidia invests US$2 billion in Nebius to build next-generation hyperscale AI cloud

Nvidia and Nebius Group announced a strategic partnership to develop and deploy a next-generation hyperscale cloud for the AI market, designed to serve both AI-native and enterprise...

Thursday 12 March 2026

Daxin expands capacity to meet rising semiconductor material demand

Daxin, a key player in semiconductor materials, has seen rapid growth in recent years. Currently, wafer process materials account for a larger share of revenue than advanced packaging...

Thursday 12 March 2026

Jiu Han targets NT$10B revenue by 2030 with NT$11.6B orders in 1Q26

Jiu Han System Technology, a leading cleanroom and turnkey project contractor, reported strong profit growth in 2025 driven by peak construction periods and approval for large-scale...

Thursday 12 March 2026

AI demand tightens supply of high-end MLCCs; Nichidenbo sees limited US-Iran impact on tantalum capacitors

Managing director Yao-Kuo Yu of Nichidenbo, a passive component distributor, stated that the AI industry's growing demand for passive components continues to tighten supplies of high-end...

Wednesday 11 March 2026

MediaTek Genio platform launches new 3nm flagship targeting high-end AIoT image processing demands

This week at Embedded World 2026 in Nuremberg, Germany, MediaTek unveiled a series of new Genio platforms designed to empower various Internet of Things (IoT) products and applications,...

Wednesday 11 March 2026

WT Microelectronics posts 89% revenue surge in 2 months on AI and market recovery

IC distributor WT Microelectronics reported consolidated preliminary revenue of NT$104.4 billion (US$3.28 billion) for February 2026, up about 29% year over year. For the first two...

Wednesday 11 March 2026

ASE breaks ground on AI advanced packaging site in Southern Taiwan, set for 2Q28 completion

ASE Technology Holding has broken ground on its third technology park in Nanzi, Kaohsiung, focused on advanced semiconductor packaging and smart logistics, with construction to start...

Wednesday 11 March 2026

Samsung Taylor fab reportedly targets HPC, automotive chips; clients reach 121

Samsung Electronics plans to focus its new foundry plant in Taylor, Texas, on high-performance computing (HPC) and automotive semiconductors...

Wednesday 11 March 2026

JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

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