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    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 25 August 2026
    Inergy server share hits 47% on cooling, BBU demand

    Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47%...

    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Monday 24 August 2026
    Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
    Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...
    Monday 24 August 2026
    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
    Monday 24 August 2026
    TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
    TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August...
    Monday 24 August 2026
    AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
    Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
    Monday 24 August 2026
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
    Monday 24 August 2026
    Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models
    Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's...
    Monday 24 August 2026
    Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

    Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

    Monday 24 August 2026
    Pixel 11 preorder surge lifts Google's Taiwan smartphone share
    Google's newly launched Pixel 11 series drew a strong preorder response in Taiwan after telecom carriers rolled out expanded promotions and sales plans. The early momentum has renewed...
    Monday 24 August 2026
    Taiwan semiconductor materials hit golden opportunity
    Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...
    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
    Monday 24 August 2026
    Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

    Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips...

    Monday 24 August 2026
    Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
    Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
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    Sep 24, 08:00
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    Wednesday 23 September 2026
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AT&S Unveils Strategy to Drive AI Growth
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