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Friday 21 August 2026
China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump
National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...
Friday 21 August 2026
Samsung holds off on High-NA EUV until 1nm production
Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy,"...

Friday 21 August 2026
Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate
High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO...
Friday 21 August 2026
Kenmec surges on AI, advanced packaging to record orders, revenue

Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec...

Thursday 20 August 2026
Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node...

Thursday 20 August 2026
China reportedly delays germanium, quartz clearances, impacting Taiwan optics and aerospace suppliers
China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery...
Thursday 20 August 2026
AMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M plan
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating...
Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
Thursday 20 August 2026
Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says,...

Thursday 20 August 2026
Jusung, PSK China sales plunge over 40% amid China's chip self-sufficiency drive

Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

Thursday 20 August 2026
Nvidia, TSMC, chip gear makers ride AI boom into high-margin club
Strong AI demand is driving a wave of high profitability across the semiconductor supply chain, with equipment and materials suppliers increasingly joining a "high-margin club." Trailing...
Thursday 20 August 2026
Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
Thursday 20 August 2026
Kenmec subsidiaries target SiC, AIDC growth

Kenmec Group founder and president Frank Hsieh said on August 19 that two of the company's new businesses have taken shape, with Taisic...