CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Wednesday 30 September 2026
Apple A20 Pro ditches PoP memory packaging for WMCM
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
Wednesday 30 September 2026
Taiwan backs TSMC's US push but insists core R&D stays home
Taiwan's semiconductor industry, which originated in the Hsinchu Science Park and later expanded to the Central and Southern Taiwan Science Parks, now encompasses manufacturing bases...
Wednesday 30 September 2026
ASE Technology buys Singapore factory for AI chip testing expansion
ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
Wednesday 30 September 2026
Netlist challenges Micron, Nvidia, Broadcom, Google over alleged HBM patent use
Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory...
Wednesday 30 September 2026
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
Wednesday 30 September 2026
AI boom draws display makers into semiconductors with glass core substrates and Micro LED
AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These...
Wednesday 30 September 2026
Murata begins mass production of world's smallest three-terminal MLCCs
Murata Manufacturing has started mass production of its LLD series, a new class of ultra-compact capacitors that could help device makers worldwide fit more power management into smaller...
Wednesday 30 September 2026
Jensen Huang, Lisa Su join Tsinghua University advisory board, putting AI chip leaders closer to Beijing

Nvidia founder and CEO Jensen Huang and AMD chair and CEO Lisa Su have joined the advisory board of Tsinghua University's School of Economics and...

Wednesday 30 September 2026
NSIG chair exit brings leadership succession into focus
National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin...
Wednesday 30 September 2026
Samsung Electro-Mechanics' disclosed 2026 supply agreements total US$2.6 billion as server demand surges
Samsung Electro-Mechanics has signed another long-term supply agreement for server components, bringing the value of its disclosed supply agreements this year to about US$2.6 billion...
Wednesday 30 September 2026
Column: Memory and logic collide as AI shifts the balance
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
Wednesday 30 September 2026
Commentary: What risks does China's DRAM capacity face amid tightening market?
China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
Wednesday 30 September 2026
DeepSeek brings software tools to Huawei's Ascend 950 to take on Nvidia
DeepSeek is bringing more of the software used to develop its AI models to Huawei Technologies' Ascend 950 processors, deepening cooperation as Chinese technology companies seek to...
Wednesday 30 September 2026
VSMC bets on value over cost as Singapore fab builds next-generation R&D and IP capabilities
VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in...
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...