Dr. Chen-Hua Douglas Yu, Vice President of Pathfinding for System Integration and the sole TSMC Distinguished Fellow, officially retired on July 8, 2025, closing a chapter in one...
IBM has introduced its latest Power11 enterprise servers in Germany, featuring the Spyre accelerator chip designed for AI inference. The chip is manufactured using Samsung Electronics'...
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
TSMC's recent decision to phase out its gallium nitride (GaN) foundry business is sending ripples through the compound semiconductor industry, opening the door for new contenders...
Beijing E-Town Semiconductor Technology Co., Ltd. (E-Town), a Chinese supplier of semiconductor manufacturing equipment, went public on the Shanghai STAR Market on July 8, 2025. The...
The Trump administration has announced new reciprocal tariffs on Southeast Asian countries to address origin washing in supply chains. This move adds complexity to the manufacturing...
Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
Topco Scientific has reported record sales for both the second quarter and first half of 2025, driven mainly by demand for semiconductor materials supporting advanced manufacturing...
Semiconductor testing and analysis companies had delivered strong June financial results with Material Analysis Technology (MA-Tek) and MSScorps both achieving new monthly revenue...
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
GlobalFoundries has announced an agreement to acquire MIPS, a supplier of AI and processor intellectual property (IP). The acquisition aims to broaden GlobalFoundries' customizable...
Intel Corp. is cutting more than 500 positions in Oregon as part of a layoff plan that's ultimately expected to affect roughly 20% of the chipmaker's staff.
High-end Ethernet chips continue to advance, while mid-range chips have expanded into broader applications. Particularly, automotive Ethernet is seeing a significant rise in adoption...
Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
