CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Tuesday 26 May 2026
Intel CEO Lip-Bu Tan Taiwan-bound for closed-door meetings ahead of Computex
Intel CEO Lip-Bu Tan is set to arrive in Taiwan this weekend, joining AMD CEO Lisa Su and Nvidia CEO Jensen Huang in a high-stakes push by the world's top chip leaders to deepen ties...
Tuesday 26 May 2026
Taiwan MLCC makers plug into AI server demand
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20...
Tuesday 26 May 2026
Wingtech sues Nexperia for US$1.2B as it fights delisting risk
Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages...
Tuesday 26 May 2026
Holy Stone Enterprise says AI power surge will deepen global MLCC shortages
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks...
Tuesday 26 May 2026
Micron expands US DDR4 output as AI keeps global supply tight
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging...
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
Tuesday 26 May 2026
ADATA outlines cloud-to-edge AI ecosystem and cost-cutting AI Scaler at COMPUTEX 2026
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming...
Tuesday 26 May 2026
Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
Tuesday 26 May 2026
Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon...

Tuesday 26 May 2026
Analysis: Nvidia's Vera CPU opens new front in data center chip race

Nvidia CEO Jensen Huang is pushing the company deeper into the CPU market, betting that the rise of agentic AI will create a new growth...

Tuesday 26 May 2026
Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...
Tuesday 26 May 2026
TSMC promises faster bonus growth in 2026 after employees threaten Samsung-style strike
Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while...
Monday 25 May 2026
Beyond Silicon Valley: Lam Capital's startup contest goes global
Lam Research's Lam Capital recently held its fourth startup competition, drawing teams from the US, South Korea, Singapore, India, and Taiwan to vie for a sizeable prize pool. US startup...
Monday 25 May 2026
Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect,...
Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...