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Wednesday 30 September 2026
CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
Wednesday 30 September 2026
Samsung expects HPC to account for 66% of foundry business by 2029
Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...
Wednesday 30 September 2026
India bars Semicon 2.0 chip plants from selling or mortgaging assets before full production
India has barred semiconductor projects approved under its Semicon 2.0 program from selling, disposing of, or mortgaging project assets until commercial production of the entire project...
Wednesday 30 September 2026
AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
Wednesday 30 September 2026
TSMC reportedly evaluates Texas fabs as US regional competition intensifies
TSMC is reportedly evaluating whether to build a second US manufacturing hub in Texas, potentially housing up to 6 advanced wafer fabs, as its US footprint continues to expand. The...
Wednesday 30 September 2026
TDK and Taiyo Yuden to explore alliance on AI-grade capacitors and inductors
TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the...
Wednesday 30 September 2026
Grand Pacific Petrochemical, Air Water join forces to expand Taiwan semiconductor materials business
Taiwan-based chemical manufacturer Grand Pacific Petrochemical (GPPC) is optimizing its core business while actively expanding into high-tech and semiconductor materials-related industries,...
Wednesday 30 September 2026
Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant
Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...
Wednesday 30 September 2026
Commentary: Garmin returns to OLED, putting Micro LED on notice
Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display...
Wednesday 30 September 2026
GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
Wednesday 30 September 2026
AI boom strains PCB supply chain as materials, equipment shortages persist into 2027
Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...
Wednesday 30 September 2026
Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
Wednesday 30 September 2026
Meta reaches agreements with Firmus on securing AI compute in Southeast Asia
Meta reached several agreements to source AI compute capacity from Firmus, an Australian neocloud, which will lease GPU compute capacity at its AI factories in Southeast Asia. The...
Wednesday 30 September 2026
Rare earths loom over US-China trade truce
The US-China trade truce was extended after last week's Trump-Xi summit, but China's dominance of rare-earth supply chains remains a key pressure point as Washington tries to stabilize...
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...