CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Friday 24 July 2026
Intel says supply, not demand, is its ceiling as it lifts 2026 capex above US$20 billion
Intel used its second-quarter 2026 earnings call on July 23 to argue that its biggest problem is no longer winning demand but building enough capacity to fill it, telling analysts...
Friday 24 July 2026
AMD's latest 2nm-EPYC rollout signals broader role for CPUs in the AI data center
AMD unveiled its sixth-generation EPYC 9006 server processors, widening its push into AI data centers with chips designed for agentic AI, cloud computing, enterprise workloads, and...
Friday 24 July 2026
Intel's blowout quarter wins over the bulls, but analysts stay split on the foundry turnaround
Intel's second-quarter results have shifted the Wall Street debate from whether chief executive Lip-Bu Tan's turnaround is working to how durable the AI-driven compute demand behind...
Friday 24 July 2026
AMD sees AI demand broadening beyond chips, as Helios ramps toward shipment
AMD CEO Lisa Su said demand from cloud service providers and enterprise customers continued to climb rapidly, reinforcing AMD's view that the artificial intelligence (AI) market still...
Friday 24 July 2026
AMD unveils Helios rack-scale AI platform to target hyperscale buildouts
AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers...
Friday 24 July 2026
AI server demand powers Intel's fastest growth since 2011, but foundry proof still pending
Intel's second-quarter 2026 results suggest the AI data-center buildout is beginning to pull the chipmaker's long-delayed turnaround forward, even as the payoff from its costliest...
Friday 24 July 2026
AMD splits next-generation data center GPUs for specialized AI demand
AMD unveiled its Instinct MI400 series at its Advancing AI 2026 conference, broadening its push into data center chips with products aimed at different users. For global readers, the...
Friday 24 July 2026
Amkor, Nvidia widen AI packaging partnership as US capacity expands
Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms...
Friday 24 July 2026
China's AI chip share tops 50%, but Nvidia still rules frontier training

China's AI infrastructure build-out is rapidly lifting demand for domestic accelerators, giving Huawei, Alibaba's T-Head Semiconductor,...

Friday 24 July 2026
Samsung to break ground on Onyang HBM expansion in October, targets 2029 production
Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting...
Friday 24 July 2026
Apple prepares sweeping Mac refresh, betting on AI-driven demand
Apple is gearing up for a broad update to its entire Mac lineup, aiming to ride the wave of demand for high-performance computers driven by AI. New versions of nearly every Mac model...
Friday 24 July 2026
Trumpf builds EUV moat with 40 years of chip tech
AI demand is continuing to drive global semiconductor investment, lifting the importance of extreme ultraviolet (EUV) lithography once again. Trumpf, the German laser maker and key...
Friday 24 July 2026
Arizona lures chip boom with three key advantages
As TSMC expands its investment in Arizona to US$265 billion, the global semiconductor supply chain is accelerating its move into the state, transforming the long-known "Sunshine State"...
Friday 24 July 2026
Zhen Ding expands Thailand capacity, deepens industry-academia ties to develop PCB, chip talent
Major printed circuit board (PCB) manufacturer Zhen Ding Technology Group has been actively developing its manufacturing base in Thailand. The investment was launched in 2023 and began...
Friday 24 July 2026
Mitsubishi Electric seeks September deal on power-chip merger with Toshiba, ROHM

Mitsubishi Electric is seeking an agreement with Toshiba and ROHM by September on combining semiconductor operations centered on power...