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Thursday 19 April 2012
20nm process to take off in 2013, says Cadence executive
The semiconductor industry will accelerate towards the adoption of 28nm process in 2012, and begin its transition to the next technology node in 2013, according to Chi-Ping Hsu, a...
Tuesday 30 August 2011
Globalfoundries tapes out 20nm test chip
Globalfoundries has announced that it successfully taped out a 20nm test chip using flows from EDA partners Cadence Design Systems, Magma Design Automation, Mentor Graphics and Synopsys...
Wednesday 13 July 2011
Samsung Foundry tapes out 20nm
Samsung Electronics has announced that its foundry business, Samsung Foundry, successfully taped-out a test chip based on its 20nm process with high-k metal gate (HKMG) technology...
Thursday 8 April 2010
TSMC delivers interoperable EDA formats for advanced process technologies
Taiwan Semiconductor Manufacturing Company (TSMC) has made available several unified and interoperable electronic design automation (EDA) technology files for its 65nm, 40nm and 28nm...
Monday 13 July 2009
EDA providers reshuffle management in Asia Pacific
Another electronic design automation (EDA) provider is reshuffling its Asia-Pacific operations, following recent regional head changes at Cadence Design Systems and Synopsys, according...
Tuesday 30 June 2009
Global Unichip to have former Cadence Asia Pacific president head China operations
Taiwan-based IC design service provider Global Unichip has decided to appoint Lung Chu, the former Asia Pacific president for EDS company Cadence Design Systems, as its China president...
Thursday 4 June 2009
Global Unichip beefing up presence in China, Japan and South Korea
Taiwan IC design service provider Global Unichip will strengthen its deployments in China, South Korea, Japan, Europe and Israel in 2009, according to company CEO KC Shih. Market...
Friday 13 March 2009
SiS joins power forward initiative to assist in delivering power-efficient computing platforms
Silicon Integrated System (SiS) has announced its joining of the Power Forward Initiative (PFI) and plans to offer common power format (CPF) design solutions for its chipset, motherboard,...
Monday 12 January 2009
China IC design industry should strengthen R&D amid economic downturn, says Cadence executive
China's IC design houses should strengthen their R&D in order to gain competitiveness within their home market against foreign rivals, when developed markets such as Europe and...
Wednesday 24 December 2008
MEMS to bring in NT$50 billion, says president of Cadence Asia Lung Chu
MEMS is expected to bring in sales worth NT$50 billion (US$1.5 billion) as long as MEMS components can be produced on a large scale, according to Lung Chu, president of Asia Pacific...
Wednesday 16 July 2008
Commentary: Low price strategy limits growth potential of players in China's IC design industry, says president of Cadence Asia
Facing emerging competitors from China, IC design companies in Taiwan constantly enhance their products and operation to keep the advantageous position in the IC design field, according...