Lip-Bu Tan, the founder of Cadence Design Systems and a prominent figure in tech venture capital, resigned abruptly from Intel's board of directors on August 19. This unexpected departure...

Cadence Taiwan country manager Brian Sung expects chip demand to start improving in the fourth quarter of 2024, with the momentum lasting throughout 2025.

US-based semiconductor solutions provider Qorvo has partnered with electronic design automation software and engineering services supplier Cadence Design Systems to help Vietnam boost...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...

The integration of Electronic Design Automation (EDA) and Software-Defined Appliances (SDA) has become critical in the AI era, according to Tom Beckley, SVP and GM of the custom IC...

Micron Technology has announced the sampling of its next-generation GDDR7 graphics memory, which it says boasts the industry's highest bit density for AI, gaming, and high-performance...

The use of Generative AI (GenAI) with Electronic Design Automation (EDA) tools to expedite the design process has emerged as a new trend, according to Cadence Design Systems.

The number of Apple suppliers in India stopped growing over the past year, as the company is looking to get more Indian suppliers on board.

As the US-China technology war enters its seventh year, with the process of domestic substitution policy of China's semiconductor industry continuing to deepen, China's local Electronic...

To drive the technologies and products of the future, creative companies rely on end-to-end solutions across chips, IPs, packages, PCBs, and systems to meet strict design requirements...

Cadence's solution includes a digital twin.

Cadence, one of the global EDA giants, expressed optimism for India-based IC design houses to differentiate themselves from global fabless semiconductor firms by designing chips for...

United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...

At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

In alignment with trends across various sectors, semiconductor firms are vigorously exploring AI-powered solutions to refine operations and boost productivity. A notable development...