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Monday 13 February 2023
Samsung, SK Hynix eyeing CXL memory solutions for auto applications
Major memory suppliers Samsung Electronics and SK Hynix reportedly are gearing up to develop CXL (compute express link)-based memory solutions, and the integration of CXL technology...
Wednesday 1 February 2023
UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies.
Thursday 24 November 2022
AI-based EDA tools increasingly crucial for IC design process
With the increasing diversity of end-use applications, IC design houses are facing increasing challenges in product design, and how to shorten the time to market for new products...
Tuesday 6 September 2022
Chinese foundries brace for further sanctions, but EDA industry remains unprepared
Former US president Donald Trump successfully prevented ASML from shipping its EUV lithography machines to China in 2019, and talks of further extending the ban to DUV machines have...
Thursday 25 August 2022
Cadence, UMC team up for 22nm analog and mixed-signal IC design flow certification
Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies...
Monday 15 August 2022
Intel elects Tan Lip-Bu as board director to assist IDM2.0 transformation
Intel Corporation has announced that Tan Lip‑Bu, the 2022 recipient of a prestigious award from the Semiconductor Industry Association (SIA), will join the company's board of...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Tuesday 30 November 2021
3D-IC can ease the ongoing global chip shortage concerns: Interview with Cadence
The technological benefits that the 3D stacking of integrated circuits brings have the potential to ease the current chip shortage concerns, according to Cadence Design Systems. As...
Friday 26 November 2021
EDAs to play crucial role in upcoming 3D IC era
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
Thursday 10 December 2020
China gearing up for homegrown EDA solutions
China is stepping up the development of homegrown EDA (electronic design automation) software and systems as part of its efforts to boost self-sufficiency in semiconductor, and many...
Friday 24 July 2020
Cadence and UMC certify mmWave reference flow on 28HPC+ process for advanced RF designs
Cadence Design Systems and United Microelectronics (UMC) have jointly announced that the Cadence millimeter wave (mmWave) reference flow has achieved certification for UMC's 28HPC+...
Monday 20 January 2020
Fab toolmakers expect strong 2020
With TSMC - the world's top pure-play foundry - anticipating record-high capex levels this year, semiconductor equipment vendors particularly those engaged in TSMC's supply chain...
Thursday 12 December 2019
Global Unichip uses Cadence digital implementation and signoff flow to deliver designs for AI, HPC applications
Cadence Design Systems has announced that Global Unichip Corporation (GUC) successfully deployed its digital implementation and signoff flow and delivered advanced-node (N16, N12...
Wednesday 4 December 2019
Cadence to acquire AWR from National Instruments
Cadence Design Systems and National Instruments (NI) have announced they have entered into a definitive agreement for the former to acquire AWR Corporation, a wholly-owned subsidiary...
Wednesday 7 August 2019
Cadence and UMC collaborate on certification of analog/mixed-signal flow for 28HPC+ process
Cadence Design Systems and United Microelectronics Corporation (UMC) have jointly announced that the US-based EDA firm's analog/mixed-signal (AMS) IC design flow has achieved certification...
Jun 2, 09:06
STMicroelectronics introduces automotive inertial module with certified ASIL B software library for a broad range of automotive applications
Friday 2 June 2023
First AI-enhanced smart accelerometers from STMicroelectronics raise performance and efficiency for always-aware applications
Thursday 1 June 2023
STMicroelectronics makes lithium batteries perform better and last longer with high-accuracy BMS controller
Thursday 1 June 2023
Computex 2023 opens with the world's best igniting the AI craze
Developing advanced processes at SMIC could become an unrealized dream of co-CEO Liang Mong Song?
Nvidia rush orders lifting TSMC 5nm fab utilization
Taiwan hits snags in cultivating high-level semiconductor talent
Taiwan keeps Chinese students from participating in semiconductor research for information security
Nvidia open to partnership with Intel, says CEO
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
China vendors see smartphone shipments down on year in 4Q22 and 1Q23, says DIGITIMES Research
Smartphone shipments to China slip over 10% sequentially in 1Q23, but to stay flat in 2Q23, says DIGITIMES Research
Global foundry revenue to drop 9% in 2023, says DIGITIMES Research
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