Tuesday 25 June 2024
Intel Foundry ecosystem partners add reference flows for EMIB advanced packaging
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
Wednesday 19 June 2024
EDA-SDA integration is vital in AI, says Cadence exec
The integration of Electronic Design Automation (EDA) and Software-Defined Appliances (SDA) has become critical in the AI era, according to Tom Beckley, SVP and GM of the custom IC...
Friday 7 June 2024
Micron samples next-gen graphics memory for gaming and AI
Micron Technology has announced the sampling of its next-generation GDDR7 graphics memory, which it says boasts the industry's highest bit density for AI, gaming, and high-performance...
Wednesday 8 May 2024
GenAI can improve chip design efficiency, says Cadence
The use of Generative AI (GenAI) with Electronic Design Automation (EDA) tools to expedite the design process has emerged as a new trend, according to Cadence Design Systems.
Monday 29 April 2024
India roundup: Apple transforms supplier base in India
The number of Apple suppliers in India stopped growing over the past year, as the company is looking to get more Indian suppliers on board.
Thursday 25 April 2024
China's domestic EDA market share doubled, thanks to support from 3,451 local IC design firms
As the US-China technology war enters its seventh year, with the process of domestic substitution policy of China's semiconductor industry continuing to deepen, China's local Electronic...
Monday 22 April 2024
Cadence says core EDA and IP domains are its India R&D center's focus
To drive the technologies and products of the future, creative companies rely on end-to-end solutions across chips, IPs, packages, PCBs, and systems to meet strict design requirements...
Friday 12 April 2024
Cadence and Arm come together to drive automotive chiplet ecosystem
Cadence's solution includes a digital twin.
Thursday 21 March 2024
Cadence encourages India-based IC design houses to target chips for global electric two-wheeler market
Cadence, one of the global EDA giants, expressed optimism for India-based IC design houses to differentiate themselves from global fabless semiconductor firms by designing chips for...
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Wednesday 27 September 2023
Cadence India poised to leverage AI on promising market demand
In alignment with trends across various sectors, semiconductor firms are vigorously exploring AI-powered solutions to refine operations and boost productivity. A notable development...
Tuesday 19 September 2023
Co-founding Cadence and Synopsis: Q&A with UC Berkeley Prof. Alberto Sangiovanni-Vincentelli (Part 2)
Professor Alberto Sangiovanni-Vincentelli is a legend of the electronic design automation (EDA) industry, but his stories were seldom told. DIGITIMES Asia is privileged to have this...
Friday 1 September 2023
3D IC still yet to be fully known, says Cadence executive
3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...
Friday 21 July 2023
Cadence to acquire Rambus PHY IP assets
Cadence Design Systems and Rambus, a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence...