TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung

Lillian Chen, Taipei; Emily Kuo, DIGITIMES Asia Monday 5 January 2026 0

Credit: AFP

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT) giants ASE and Amkor, rather than allowing customer orders to flow to...

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