With widespread speculation about the US government considering further restrictions on the export of Nvidia's A800 and H800 GPUs to China, Intel has chosen this opportune moment...
It appears that Intel strategically announced the launch of its customized AI processor, Habana Gaudi 2, for the Chinese market at a press conference held July 11 in Beijing, shortly...
Samsung Electronics will invest KRW1 trillion (approx. US$766 million) to expand its high bandwidth memory (HBM) production capacity. Sources believe that Samsung's investments are...
To what extent can artificial intelligence (AI) support and assist in chip design? Following recent examples of AI-assisted chip design in both China and the United States, there...
One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
TSMC is expected to see a significant revenue rebound in the second half of the year, which will be driven by not only the launch of new iPhones but also strong demand for AI chips...
The US is reportedly contemplating new restrictions on the supply of artificial intelligence (AI) chips to China, seeking to further curb the growth of China's semiconductor industry...
Due to the bandwidth limitations of DDR SDRAM in high-speed computation, high bandwidth memory (HBM) is rapidly gaining popularity as a means to circumvent memory transmission speed...
AMD CEO Lisa Su and other senior executives will travel to Taiwan in the middle of July to confer with local PC and server industry supply chain partners and customers, according...
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
The production of AI server chips necessitates not only advanced process fabrication but also the packaging used for high-end HPC processors; however, the supply of advanced packaging...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
With the latest generative AI boom, GPUs from Nvidia or AMD are the first choice for AI servers and high-performance computing data centers. But in China, even if they can only get...
AMD has announced plans to invest up to US$135 million in Ireland over the next four years. The investment is intended to fund a number of strategic R&D initiatives through the...
