Phison Electronics, a specialist in NAND flash device controllers, is set to enter mass production of PCIe 5.0 retimer ICs in the first quarter of 2024, anticipating a surge in server...
In the rapidly evolving semiconductor industry, the emergence of CXL (Compute Express Link) as an interconnect specification has captured the spotlight. Samsung Electronics and SK...
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Backend companies are positive about demand for Sony's new slimmed-down PlayStation 5 (PS5), which will hit the shelves in mid-November, according to industry sources.
Huawei unconventionally releasing its Mate 60 Pro 5G smartphone in late August witout prior notice garnered global attention, but during the subsequent official product launch event...
Previously, at the Code Conference held in California, AMD CEO Lisa Su discussed topics covering the AI industry, expansion of domestic semiconductor production in the US, Huawei's...
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
With Intel splitting its manufacturing and design divisions, competitors such as AMD and Nvidia are already considered as potential Intel customers, said Intel CEO Pat Gelsinger during...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
To ensure their competitiveness, vertical integration isn't merely a catchphrase for businesses; it's an ongoing imperative. When TSMC focuses on advanced packaging, what's ASE's...
