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NEWS TAGGED 65NM
Tuesday 4 August 2009
TSMC promoting OIP by combining EDA, IP
Taiwan Semiconductor Manufacturing Company (TSMC) is making efforts to make its OIP (Open Innovation Platform) - a technology platform for integrated services from IC design to manufacturing...
Thursday 30 July 2009
TSMC shipments more than double in 2Q09; ups capex for 2009
Taiwan Semiconductor Manufacturing Company (TSMC) posted consolidated revenues of NT$74.21 billion for the second quarter, up 87.9% from NT$39.5 billion in the first. On an annual...
Friday 24 July 2009
Chartered expects narrower loss for 3Q09, raises capex
Singapore's Chartered Semiconductor Manufacturing continued to suffer a loss in second-quarter 2009, but saw the loss narrow to US$39.4 million compared to a loss of US$98.8 million...
Wednesday 22 July 2009
TSMC intros interoperable PDK, unified EDA formats for advanced processes
Taiwan Semiconductor Manufacturing Company (TSMC) has launched an interoperable process design kit (iPDK) for use in 65nm analog/mixed-signal and RF designs. TSMC has also introduced...
Monday 20 July 2009
SMIC and Magma launch reference flow for low-power 65nm
Semiconductor Manufacturing International Corporation (SMIC) and Magma Design Automation on July 20 jointly announced availability of a low-power IC implementation reference flow...
Thursday 16 July 2009
Winbond remains cautious about expansion
Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...
Wednesday 15 July 2009
Elpida reportedly developing die-shrink 50nm process without expenditure on new tools
Elpida Memory has been quietly developing a technology based on its existing 65nm equipment for DRAM production, to enable a die shrink to 50nm, industry sources have claimed. The...
Wednesday 15 July 2009
Chartered offers 65nm RF process for wireless applications
Chartered Semiconductor Manufacturing has recently ramped up production of its 65nm low-power (LP) process, dubbed 65nm LPe, targeting battery-operated and cost-sensitive mobile applications...
Tuesday 7 July 2009
UMC denies yield problems with its 65nm process
United Microelectronics Corporation (UMC) has responded to recent speculation indicating its 65nm yield problems have affected shipments to Xilinx. UMC asserted that there are no...
Monday 6 July 2009
Xilinx Virtex-5 supply issue caused by 65nm yield problems at UMC, say sources
United Microelectronics Corporation (UMC) is seeing yield problems with its 65nm process, which are disrupting supply to major FPGA customer Xilinx, according to industry sources...
Monday 6 July 2009
PSC says DRAM ASP and shipments up in June
Powerchip Semiconductor Corporation (PSC) has announced unaudited net sales of NT$2.12 billion (US$64.51 million) for June 2009, up 40.9% from May's NT$1.51 billion. The Taiwan-based...
Friday 3 July 2009
Intel to use IP from TSMC to make Langwell chipset, says paper
Intel will adopt silicon IP from Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture a customized version of its Langwell chipset (the chipset component of its next-generation...
Friday 3 July 2009
TSMC unveils commercial 65nm multi-time programmable NVM
Taiwan Semiconductor Manufacturing Company (TSMC) has announced what it claims to be the foundry segment's first functional 65nm multi-time programmable (MTP) non-volatile memory...
Thursday 2 July 2009
TSMC processes over five million 12-inch wafers based on sub 0.13-micron nodes
Taiwan Semiconductor Manufacturing Company (TSMC) has cumulatively shipped over five million 12-inch equivalent wafers of chips processed with sub 0.13-micron processes, according...
Wednesday 1 July 2009
SMIC claims silicon success with generic 45nm
Semiconductor Manufacturing International Corporation (SMIC) has announced the successful completion of its first 45nm GP (generic process) yield lot. The China-based foundry signed...